According to reports, MediaTek has taken the lead in the recovery of the smartphone market, and its shipment momentum next year is expected to be significantly better than this year. MediaTek will hold a press conference this Friday (27th) and is currently in a period of silence before the conference. Foreign investors are optimistic about MediaTek’s strong follow-up power and have already issued a target price of 1,000 yuan.

According to news from the supply chain, MediaTek’s Dimensity 9400, which will be launched next year, will not come out until the second half of the year, but it is expected to enter mass production as soon as February next year, one to two months earlier than before.

According to previous reports, in September this year, MediaTek and TSMC released news that MediaTek’s first Dimensity flagship chip using TSMC’s 3nm process will be launched in the second half of next year. Tape-out has been completed and is expected to be the Dimensity 9400.

TSMC pointed out that compared to the 5nm process, TSMC’s 3nm process technology has an increase in logic density of approximately 60%, an 18% increase in speed at the same power consumption, or a 32% reduction in power consumption at the same speed.

THIS IS A SPONSOR PROMOTION: >>>>>>>>>>>>>

Geekwills is an online shop that connects consumers with millions of products and brands around the world with the mission to empower them to live their best lives. Geekwills is committed to offering the most affordable quality products to enable consumers and sellers to fulfill their dreams in an inclusive environment.

The post MediaTek Dimensity 9400 chip will be mass-produced one to two months ahead of schedule appeared first on TechGoing.

According to reports, it was previously reported that Samsung Electronics’ 3nm yield rate exceeded 60% and that it had delivered a chip to a Chinese customer. However, since this process omits SRAM in the logic chip, it is difficult to regard it as a “complete product.” 3nm chip”.

The industry believes that although Samsung has taken the lead in mass production of its 3nm all-gate technology (GAA), its output is not enough to influence large customers. In this technology, since the gate electrode surrounds four sides of the current path in the transistor that makes up the semiconductor, the difficulty naturally increases compared with the previous process of surrounding three sides. A person familiar with Samsung revealed, “To win orders for 3nm mobile chips from major customers such as Qualcomm next year, the yield rate needs to be increased to at least 70%.”

As for TSMC, although it is the only company with a 3nm mass production record, its output is also lower than initially expected. Some analysts said that TSMC’s 3nm process uses the same FinFET structure as the previous generation process and may “fail to control” overheating issues.

Both companies are still working toward achieving a yield rate of more than 60 percent. TSMC plans to mass-produce N3E, N3P, N3X, N3AE, etc. next year. The focus is to improve the yield rate and reduce costs.

In addition, a semiconductor industry insider revealed that Samsung, TSMC and Intel are all preparing for the 2nm process, but compared with 3nm, the improvement in performance and power consumption efficiency is “not obvious”, so the demand for 3nm process chips is expected to last. Exceeded expectations.

It was previously reported that Tianfeng International analyst Ming-Chi Kuo posted an article on the X platform (formerly Twitter) at the end of last month, explaining the current overheating problem of Apple’s iPhone 15 Pro phone, and stated that it “has nothing to do with TSMC’s 3nm process.”

Ming-Chi Kuo said: “My investigation pointed out that the overheating problem of the iPhone 15 Pro series has nothing to do with TSMC’s 3nm process. It is mainly likely to be lighter in weight, so compromises were made on the heat dissipation system design, such as smaller heat dissipation area, The use of titanium alloy affects the heat dissipation effect, etc. It is expected that Apple will fix this problem by updating the system, but unless the processor performance is reduced, the improvement effect may be limited. If Apple does not properly solve this problem, it may be detrimental to the iPhone 15 Pro series. Shipments per cycle.”

THIS IS A SPONSOR PROMOTION: >>>>>>>>>>>>>

Geekwills is an online shop that connects consumers with millions of products and brands around the world with the mission to empower them to live their best lives. Geekwills is committed to offering the most affordable quality products to enable consumers and sellers to fulfill their dreams in an inclusive environment.

The post Samsung, TSMC 3nm yield about 50%, expected to affect the competition for next year’s orders appeared first on TechGoing.

According to reports, the fluctuations in orders from leading phone chip companies often depend on the end market’s judgment of the market demand expectations in the next stage. Currently, MediaTek’s domestic share of phone chips is close to 50%.

Prior to this, Weibo blogger @手机 Chipmaster had posted on Thursday claiming, “After the release of Company H’s phone, MediaTek began to slash the number of wafers produced in 2024” and used “Butterfly” Effect” to evaluate this phenomenon.

The blogger also previously said that without external interference, if 60 million 5G phones can be sold next year, MediaTek and Qualcomm will reduce shipments of 60 million 5G phone chips if the global TAM remains unchanged.

According to previous reports, MediaTek announced revenue data for August 2023 yesterday:

 Revenue in August was NT$42.26 billion, a year-on-year decrease of 5.47%.

 Cumulative revenue from January to August this year was NT$267.806 billion, a year-on-year decrease of 30.26%.

MediaTek recently announced that the development of its first Dimensity flagship chip produced using TSMC’s 3nm process is progressing very smoothly. It has been successfully tape-out and is expected to be mass-produced next year.

The post MediaTek denies rumors of significant cuts in wafer production volume in 2024 appeared first on TechGoing.

According to reports, TSMC’s 3nm process technology not only provides complete platform support for high-performance computing and mobile applications but also has enhanced performance, power consumption and yield. Compared with the 5nm process, TSMC’s 3nm process technology has a logic density increase of approximately 60%, an 18% increase in speed at the same power consumption, or a 32% reduction in power consumption at the same speed.

MediaTek said its first Dimensity flagship chip using TSMC’s 3nm process will be available in the second half of 2024.

Currently, major chip manufacturers in the industry are working on the 3nm process, including Apple’s iPhone, which is expected to be the first to take over TSMC’s 3nm production capacity. We can look forward to seeing it in this year’s latest A17 chip. In addition, Qualcomm’s 3nm chip has no accurate information yet, and it is expected to compete with MediaTek again.

The post MediaTek Dimensity flagship chip using TSMC’s 3nm process to be available in 2024 appeared first on TechGoing.

According to DigiTimes, Apple, which has booked all of TSMC’s 3nm process technology this year, has recently cut orders, which will also cause TSMC’s monthly production of this process technology to drop to 50,000-60,000 wafers in the fourth quarter of this year, which will not reach the previous level. Expected 80,000-100,000 wafers.

In addition, the current monthly output of TSMC’s 3nm process technology is expected to be around 65,000 wafers, which means that if the monthly output in the fourth quarter is really 50,000-60,000 wafers as reported, it will not increase but decrease compared to the current one. .

Since Apple is the main customer after the mass production of TSMC’s advanced process technology, and the 3nm process technology OEM price is higher, Apple’s reduction of orders will affect their revenue for this process technology. If the monthly output in the fourth quarter is lower than the three quarter, may also cause their quarterly revenue to decline sequentially.

In addition, DigiTimes mentioned that since Apple’s orders occupy most of the production capacity of TSMC’s 3nm process technology production line, TSMC is also unable to undertake orders from major customers such as Qualcomm and AMD in the short term, and it is difficult to offset the impact of Apple’s order reduction.

The post TSMC’s 3nm production to fall below 60,000 wafers in Q4 as Apple cuts orders appeared first on TechGoing.

According to sources, due to the delay of Intel’s purchase, Apple will contract all 3nm production capacity of TSMC this year for the upcoming iPhone, Mac and iPad.

On the iPhone 6S, Apple tried to distribute the manufacturing of A-series chips to TSMC and Samsung for production. Later, TSMC won all the orders for A10 Fusion in Apple’s iPhone 7 through more advanced technology and has since become the only foundry for A-series chips. square.

Of course, the same goes for Apple Silicon, which is used in Macs and iPads, and TSMC currently controls all of Apple’s chipmaking operations.

In fact, as early as May this year, it was reported that Apple had reserved nearly 90% of TSMC’s production capacity for its next-generation devices. However, since Intel later revised its CPU production plan, this also means that Apple won TSMC’s 100% production capacity in 2023. % of production capacity.

The industry believes that the delay in Intel’s orders means that TSMC’s sales of 3nm chips will drop sharply this year, and the industry source said that TSMC is still expected to achieve significant growth in the fourth quarter because it has begun mass production of 3nm chips to meet Apple’s demand.

Data show that TSMC’s 3nm chip production in the fourth quarter may be reduced to 50,000-60,000 pieces per month from the previously expected 80,000-100,000 pieces (wafers). According to the source, TSMC’s current monthly output of the 3nm process is only about 65,000 pieces.

According to the previously exposed running scores of the A17 Bionic processor (iPhone 15 Pro), the A17 will continue to use a 6-core CPU similar to the A16, and Geekbench 6 results show that the two performance cores have the same clock speed of 3.70GHz.

The results show that the single-core score of the A17 in the benchmark test is 3269 points, which is 31% higher than that of the A16. In the multi-core test, the gap isn’t that big, with the A17 outperforming the A16 by 24%, but still very good.

The Geekbench 6 image also shows the Metal score, which tests the GPU of the upcoming SoC, scoring 30,669 points.

These running score results make people look forward to the upcoming iPhone 15 series, but it needs to be pointed out that these running score results may be modified or forged, so before Apple officially releases the iPhone 15 series, we still have to check and be sceptical.

The post Intel Chip Order Delayed, Apple Will Round Up All TSMC’s 3nm Capacity for the Year appeared first on TechGoing.

According to reports, Arete Research senior analyst Brett Simpson believes that TSMC and Apple have reached a special agreement where Apple only pays for qualified wafers instead of paying standard pricing. Standard wafer prices could be as high as $17,000 per wafer (currently about RMB 122,000) but TSMC will probably only start implementing this business model for Apple in the second half of 2024.

The 3-nanometer process is one of the most advanced chip manufacturing technologies available, improving chip performance and efficiency, and reducing power consumption and costs. Apple plans to launch the A17 Bionic and M3 chips using the process, the former for the iPhone 15 Pro and iPhone 15 Pro Max. TSMC expects to be able to produce 100,000 3nm wafers per month by the end of 2023 to meet Apple’s demand. However, with a yield of only 55%, only 55,000 wafers will be available. Apple will only pay the standard wafer price if the yield reaches 70% , but that reportedly won’t happen until the first half of 2024.

There are also rumors that Apple could move to using TSMC’s alternative 3nm process, N3E, in 2024, which is said to have better yields and lower production costs. However, this could also result in lower performance for the A17 Bionic and M3 chips, so Apple hasn’t made a decision yet.

The post TSMC 3nm process A17 Bionic, M3 yield is only 55% appeared first on TechGoing.

Since TSMC’s 3nm is not much different from 4nm under the performance of PPA, and the quotation of 3nm has risen to 20,000 US dollars, although only Apple can enjoy a 20% discount, but there are already many customers revised the process planning, adjusted the production and orders, including lengthening the 4/5nm generation cycle, slowing down the progress of N3E and N3P adoption, and waiting for the 2nm GAA process generation to re-deposit.

He believes that although TSMC’s production capacity layout may be disrupted, customers have a higher degree of stickiness and are quite confident in the 2nm GAA generation. Almost all customers who have adopted 4/3nm have 2nm production plans.

According to previous news, Apple has almost rounded up nearly 90% of TSMC’s first-generation 3-nanometer process capacity this year for future iPhone, Mac and iPad chips.

Apple’s upcoming iPhone 15 Pro series models are expected to feature the A17 Bionic processor, Apple’s first iPhone chip based on TSMC’s first-generation 3-nanometer process, also known as N3B. The 3-nanometer technology is said to be 35% more energy efficient and 15% more performant than the 4-nanometer process used to make the A16 Bionic chip in the iPhone 14 Pro and Pro Max.

Apple’s M3 chip for Macs and iPads is also expected to use a 3nm process. The first devices to feature the M3 are expected to include the new 13-inch MacBook Air and 24-inch iMac, both of which could arrive later this year. New iPad Pro models due next year may also feature the M3 chip, while Apple analyst Ming-Chi Kuo believes the 14- and 16-inch MacBook Pro models due in 2024 will feature the M3 Pro and M3 Max chips.

According to an App Store developer log obtained by Bloomberg’s Mark Gurman, Apple is currently testing a new chip with a 12-core CPU, 18-core GPU and 36GB of memory, which could be the next generation of 14-inch and The base M3 Pro chip found in the 16-inch MacBook Pro models.

According to DigiTimes, TSMC is also working on a more advanced 3nm process called N3E. Apple devices will eventually switch to the N3E process, which is expected to begin commercial production in the second half of 2023, but actual shipments will not ramp up until 2024.

The post TSMC’s almost all customers who have adopted 4/3nm have 2nm production plans appeared first on TechGoing.

It was previously reported that Apple’s upcoming iPhone 15 Pro series models are expected to feature the A17 Bionic processor, Apple’s first iPhone chip based on TSMC’s first-generation 3-nanometer process, also known as N3B. The 3-nanometer technology is said to be 35% more energy efficient and 15% more performant than the 4-nanometer process used to make the A16 Bionic chip in the iPhone 14 Pro and Pro Max.

Apple’s M3 chip for Macs and iPads is also expected to use a 3nm process. The first devices to feature the M3 are expected to include the new 13-inch MacBook Air and 24-inch iMac, both of which could arrive later this year. New iPad Pro models due next year may also feature the M3 chip, while Apple analyst Ming-Chi Kuo believes the 14- and 16-inch MacBook Pro models due in 2024 will feature the M3 Pro and M3 Max chips.

According to an App Store developer log obtained by Bloomberg’s Mark Gurman, Apple is currently testing a new chip with a 12-core CPU, 18-core GPU and 36GB of memory, which could be the next generation of 14-inch and The base M3 Pro chip found in the 16-inch MacBook Pro models.

According to DigiTimes, TSMC is also working on a more advanced 3nm process called N3E. Apple devices will eventually switch to the N3E process, which is expected to begin commercial production in the second half of 2023, but actual shipments will not ramp up until 2024.

The post Apple booked nearly 90% of TSMC’s 3nm production capacity for the iPhone 15 Pro series A17 processor appeared first on TechGoing.

Pat Gelsinger is expected to appear at his annual Intel Vision technology conference on May 21, according to people familiar with the matter. In addition to explaining Intel’s latest blueprint, he will also discuss 3nm process cooperation with TSMC President Wei Zhejia and seek TSMC’s foundry capacity support. It was previously reported that Pat Gelsinger had visited TSMC twice in April and December 2022, but Pat Gelsinger’s second visit was at TSMC’s Arizona wafer plant in the United States when the “first batch of machine equipment arrived”. Factory” ceremony, so failed to meet with TSMC’s top decision-makers.

In recent years, Intel has faced crises such as the loss of market share, two consecutive quarters of losses, and delays in new manufacturing processes, which have led to a sharp drop in confidence in the supply chain. The reason why it is difficult to increase and the capacity utilization rate is not as expected.

According to Intel’s previous plan, cooperation with TSMC on the 3nm process will be officially launched on the Arrow Lake processor released in the second half of 2024.

The post Intel CEO Pat Gelsinger will visit TSMC for the third time in late May to restart 3nm cooperation appeared first on TechGoing.