Taiwan Electronics Co., Ltd. jointly announced today that the development of MediaTek’s first Dimensity flagship chip produced using TSMC’s 3nm process is progressing very smoothly. It has been successfully tape-out and is expected to be mass-produced next year.
According to reports, TSMC’s 3nm process technology not only provides complete platform support for high-performance computing and mobile applications but also has enhanced performance, power consumption and yield. Compared with the 5nm process, TSMC’s 3nm process technology has a logic density increase of approximately 60%, an 18% increase in speed at the same power consumption, or a 32% reduction in power consumption at the same speed.
MediaTek said its first Dimensity flagship chip using TSMC’s 3nm process will be available in the second half of 2024.
Currently, major chip manufacturers in the industry are working on the 3nm process, including Apple’s iPhone, which is expected to be the first to take over TSMC’s 3nm production capacity. We can look forward to seeing it in this year’s latest A17 chip. In addition, Qualcomm’s 3nm chip has no accurate information yet, and it is expected to compete with MediaTek again.
