According to Taiwan media “United Daily News”, chip giant Intel CEO Pat Gelsinger will visit TSMC for the third time in late May to discuss restarting 3nm process cooperation and Seeking TSMC’s wafer foundry production capacity support.
Pat Gelsinger is expected to appear at his annual Intel Vision technology conference on May 21, according to people familiar with the matter. In addition to explaining Intel’s latest blueprint, he will also discuss 3nm process cooperation with TSMC President Wei Zhejia and seek TSMC’s foundry capacity support. It was previously reported that Pat Gelsinger had visited TSMC twice in April and December 2022, but Pat Gelsinger’s second visit was at TSMC’s Arizona wafer plant in the United States when the “first batch of machine equipment arrived”. Factory” ceremony, so failed to meet with TSMC’s top decision-makers.
In recent years, Intel has faced crises such as the loss of market share, two consecutive quarters of losses, and delays in new manufacturing processes, which have led to a sharp drop in confidence in the supply chain. The reason why it is difficult to increase and the capacity utilization rate is not as expected.
According to Intel’s previous plan, cooperation with TSMC on the 3nm process will be officially launched on the Arrow Lake processor released in the second half of 2024.
