According to Korean media ChosunBiz, industry insiders analyzed on the 4th of this month that the 3nm process yield rates of Samsung Electronics and TSMC are currently around 50%.
According to reports, it was previously reported that Samsung Electronics’ 3nm yield rate exceeded 60% and that it had delivered a chip to a Chinese customer. However, since this process omits SRAM in the logic chip, it is difficult to regard it as a “complete product.” 3nm chip”.
The industry believes that although Samsung has taken the lead in mass production of its 3nm all-gate technology (GAA), its output is not enough to influence large customers. In this technology, since the gate electrode surrounds four sides of the current path in the transistor that makes up the semiconductor, the difficulty naturally increases compared with the previous process of surrounding three sides. A person familiar with Samsung revealed, “To win orders for 3nm mobile chips from major customers such as Qualcomm next year, the yield rate needs to be increased to at least 70%.”
As for TSMC, although it is the only company with a 3nm mass production record, its output is also lower than initially expected. Some analysts said that TSMC’s 3nm process uses the same FinFET structure as the previous generation process and may “fail to control” overheating issues.
Both companies are still working toward achieving a yield rate of more than 60 percent. TSMC plans to mass-produce N3E, N3P, N3X, N3AE, etc. next year. The focus is to improve the yield rate and reduce costs.
In addition, a semiconductor industry insider revealed that Samsung, TSMC and Intel are all preparing for the 2nm process, but compared with 3nm, the improvement in performance and power consumption efficiency is “not obvious”, so the demand for 3nm process chips is expected to last. Exceeded expectations.
It was previously reported that Tianfeng International analyst Ming-Chi Kuo posted an article on the X platform (formerly Twitter) at the end of last month, explaining the current overheating problem of Apple’s iPhone 15 Pro phone, and stated that it “has nothing to do with TSMC’s 3nm process.”
Ming-Chi Kuo said: “My investigation pointed out that the overheating problem of the iPhone 15 Pro series has nothing to do with TSMC’s 3nm process. It is mainly likely to be lighter in weight, so compromises were made on the heat dissipation system design, such as smaller heat dissipation area, The use of titanium alloy affects the heat dissipation effect, etc. It is expected that Apple will fix this problem by updating the system, but unless the processor performance is reduced, the improvement effect may be limited. If Apple does not properly solve this problem, it may be detrimental to the iPhone 15 Pro series. Shipments per cycle.”
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