According to Taiwanese media “Economic Daily”, TSMC revealed at a meeting in France that it has seen signs of improvement in the inventory adjustment of two major applications such as PCs and mobile phones. It is reported that MediaTek is scheduled to release in the second half of next year. The new 5G flagship chip Dimensity 9400 is expected to enter mass production as soon as February next year, one to two months earlier than before, and will be adopted by major brands such as OPPO, vivo, and Xiaomi.
According to reports, MediaTek has taken the lead in the recovery of the smartphone market, and its shipment momentum next year is expected to be significantly better than this year. MediaTek will hold a press conference this Friday (27th) and is currently in a period of silence before the conference. Foreign investors are optimistic about MediaTek’s strong follow-up power and have already issued a target price of 1,000 yuan.
According to news from the supply chain, MediaTek’s Dimensity 9400, which will be launched next year, will not come out until the second half of the year, but it is expected to enter mass production as soon as February next year, one to two months earlier than before.
According to previous reports, in September this year, MediaTek and TSMC released news that MediaTek’s first Dimensity flagship chip using TSMC’s 3nm process will be launched in the second half of next year. Tape-out has been completed and is expected to be the Dimensity 9400.
TSMC pointed out that compared to the 5nm process, TSMC’s 3nm process technology has an increase in logic density of approximately 60%, an 18% increase in speed at the same power consumption, or a 32% reduction in power consumption at the same speed.
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