Which phones will be equipped with Dimensity 9200+?

The most likely guess based on the information so far is:

iQOO iQOO Neo8 Pro and Redmi K60 Ultra

Specs of iQOO Neo8 Pro

1. Two models, iQOO Neo8 and Neo8 Pro, will be launched together.
2. According to information, the standard version may be equipped with Snapdragon 8+ chip, while the Pro version will be equipped with Dimensity 9200+
3. It will also be equipped with 16Gb LPDDR5X memory and 512Gb UFS4.0 storage
4. The positioning of the whole machine will be in the 3,000 yuan range(About USD500).

Specs of Redmi K60 Ultra

1. A higher refresh rate and faster charging speed may be added
2. More camera functions and AI technologies may be added
3. The new version of the Remi K60 series may not be unveiled until after May, but it is certain that it will be equipped with Dimensity 9200+, and it will also become the highest configuration processor in the K60 series.

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RELATED: Vivo X90 Specifications Revealed Via TENAA Listing

Vivo X90 Pro Specifications (Rumored)

The Vivo X90 Pro measures 164.07 x 74.53 x 9.34mm and weighs around 214.85 grams, which is a bit heavy. It has a 6.78-inch AMOLED display that offers a resolution of 1260 x 2800 pixels. The device houses a 2 x 2375mAh dual-cell battery, which indicates that it may house a 4,850mAh typical value battery. The 3C certification of the device suggested that it will support 120W fast charging.

On the front, it has a 32MP selfie camera. Its back panel has a 50MP main camera, which appears to be a 1-inch Sony IMX989 lens. It is coupled with a 50MP camera and a 12MP snapper with 2x optical zoom.

The device is powered by the Dimensity 9200 chipset, which is mentioned with its 3.05GHz processing speeds in the TENAA listing. It has 8GB / 12GB / 16GB of RAM and 128GB / 256GB / 512GB of storage.

The X90 Pro is equipped with other features like an IR blaster and an under-display fingerprint canner. It will come preinstalled with the OriginOS 3-based Android 13 OS. It is expected to arrive in black and red colors.

Source

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Vivo X90 Specifications

The Vivo X90 has a 6.78-inch AMOLED display that offers a 1.5K resolution of 1260 x 2800 pixels and 10-bit colors. The screen is integrated with a fingerprint scanner. As revealed through its Geekbench appearance, the device will come preloaded with Android 13 OS, which will be overlaid with ColorOS 13.

The Dimensity 9200 is present under the hood of the Vivo X90. The exact name of the chip is not mentioned in the listing. Instead, it mentions its processing speed of 3.05GHz. It will come with 8GB, 12GB, 16GB of RAM, and 128GB, 256GB, and 512GB of storage.

On the front, it has a 32-megapixel front-facing camera. The back panel of the device has a 50-megapixel main camera and a pair of 12-megapixel cameras. One of them seems to be a telephoto camera with 2x optical zoom support. Apart from connectivity options like Wi-Fi and Bluetooth, the device will also feature an IR blaster.

The listing further reveals that the Vivo X90 is equipped with a 2,345mAh dual-cell battery. It appears that its battery will have a typical value of 4,800mAh. The 3C certification of the device has revealed that it will support 120W fast charging.

The Vivo X90 measures 164.10 x 74.44 x 8.88mm and weighs around 196 grams. Recent reports say that it will come in black, blue, and red.

Source|Via

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Tipster Digital Chat Station has revealed that the Vivo X90 will be equipped with a 1.5K resolution display. He added that the device will be powered by the Dimensity 9200, which hasn’t gone official yet. To recall, the Vivo X80 was powered by the Dimensity 9000 chipset.

Speaking of the Dimensity 9200, the new chip has appeared on the AnTuTu benchmarks. The SoC has recorded a total score of 1,266,102. It is a total of a CPU score of 273,413, a GPU score of 550,767, a memory score of 246,809, and a UX score of 195,113. According to the tipster, the chipset is equipped with a Cortex X3 main CPU. The chipset is expected to go official in November.

Coming back to the X90 leak, it will carry support for 120W fast charging. The tipster has previously revealed that the device will pack a 4,700mAh dual-cell battery. The device has been previously tipped to feature a Sony IMX8-series primary camera. However, he has tipped that the device will offer improved dust and water resistance than its predecessor. However, it will not have an IP68 rating.

Source

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According to the latest news from the Digital Gossip Station, the release of the dimensity 9200 platforms will precede the Snapdragon 8 Gen2, and the first model has been topped internally on November 2X, which will be directly head-on to the Snapdragon 8 Gen2.

From previous revelations, it appears that the Skyguard 9200 will use the latest TSMC 4nm process, with the CPU architecture upgraded to a new generation of mega-core Cortex-X3.

The X3 cores are said to be 25% more powerful and have a much-improved power efficiency ratio, with a claimed performance increase of up to 25% over the previous generation of Android flagships, and a 34% lead over laptop CPUs.

The GPU will use the latest Immortalis-G715, which features hardware-level ray tracing support and a 300% increase in performance compared to software-accelerated light tracing.

Overall performance is also 15% better than the previous generation Mail-G710 and power consumption is reduced by 15%.

Overall, the Breguet 9200 will be a superb performance flagship with more aggressive performance and optimized energy efficiency.

As usual, the Blue-Green camp usually takes the first launch from MediaTek, and this time the first launch model of the Skyguard 9200 will probably be born among these two parties, which is worth waiting for.

The post MediaTek’s first dimensity 9200 flagships may debut in late November appeared first on TechGoing.

Previously, it was revealed that the iteration of the Dimensity 9 series platform was known in the industry as “DX2”, while today Weibo blogger @DigitalChat revealed that the chip will be called Dimensity 9200 and is expected to be released in November.

Weibo blogger @i冰宇宙 says that, as usual, the Tiangui 9200 chip is expected to feature an X3 big-core CPU with ARM’s latest G715 GPU, which will give it a considerable boost. In terms of performance, the engineering machine equipped with the Dimensity DX2 chip is currently scoring better than the Qualcomm Snapdragon 8 Gen 2.

The new model will be available in the form of a new model from the supply chain, including two from the Vivo X series, one from the OPPO Find X series, and one from a gaming brand.

In November last year, MediaTek launched its first 4nm flagship chip, the Dimensity 9000, and in June this year, MediaTek officially launched a smaller upgrade to the chip, the Dimensity 9000+. The 9200 chip is still expected to use TSMC’s 4nm process.

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