Qualcomm has already teased that the Snapdragon Summit will be held in November this year, with the release of the Snapdragon 8 Gen 2 flagship chip expected, while the other side of the coin is MediaTek’s Dimensity 9 iteration, which is also coming soon.
Previously, it was revealed that the iteration of the Dimensity 9 series platform was known in the industry as “DX2”, while today Weibo blogger @DigitalChat revealed that the chip will be called Dimensity 9200 and is expected to be released in November.
Weibo blogger @i冰宇宙 says that, as usual, the Tiangui 9200 chip is expected to feature an X3 big-core CPU with ARM’s latest G715 GPU, which will give it a considerable boost. In terms of performance, the engineering machine equipped with the Dimensity DX2 chip is currently scoring better than the Qualcomm Snapdragon 8 Gen 2.
The new model will be available in the form of a new model from the supply chain, including two from the Vivo X series, one from the OPPO Find X series, and one from a gaming brand.
In November last year, MediaTek launched its first 4nm flagship chip, the Dimensity 9000, and in June this year, MediaTek officially launched a smaller upgrade to the chip, the Dimensity 9000+. The 9200 chip is still expected to use TSMC’s 4nm process.
