Vivo officially announced today that the new generation of flagship phones Vivo X90 series and Hi-Fi wireless headphones Vivo TWS 3 series will be released on November 22, 19:00, please look forward to it.
According to the previously revealed information, the new Vivo X90 series will include three versions, X90, X90 Pro and X90 Pro +, which will be equipped with Dimensity 9200, Dimensity 9200 and Snapdragon 8 Gen2 flagship platforms respectively. It is worth mentioning that the Vivo X90 series will have the world’s first Dimensity 9200 chip.
Another heavyweight new product Vivo TWS 3 series headphones claimed to be equipped with a new generation of LE Audio Bluetooth audio technology, support Bluetooth 5.3, the industry’s first full-link wireless true Hi-Fi, as well as intelligent ultra-wideband noise reduction, non-sensitive body temperature monitoring, LC3 game low latency, multi-device dual connection, etc.
According to the previous preview, the Vivo TWS 3 series headset transmission bit rate of up to 1.2Mbps, equipped with a high-performance DAC chip, will also be equipped with an ultra-wideband HD unit above 40kHz.
According to the latest score of Vivo’s product manager Han Bo Xiao, the Vivo X90 with the Dimensity 9200 has a Rabbit score of 1284467.
The chip is based on TSMC 4nm process, its CPU part is “1 + 3 + 4” eight-core architecture, consisting of 1 * 3.05GHz X3 + 3 * 2.85GHz A715 + 4 * 2.0GHz A510, the GPU is Immortalis -G715 MC11, and it is also the first GPU under Arm to support hardware ray tracing, which can bring more realistic and immersive light and shadow picture effects.
