Vivo has officially announced that the Vivo X90 series and Vivo TWS 3 series headphones will be released on November 22.
Now, Vivo has released the official renders of the TWS 3 series headphones. According to the report, these will be Vivo’s world’s first true Hi-Fi wireless headphones.
From the previous preview content, Vivo TWS 3 series headphones have more gimmicks, claiming to be equipped with a new generation of LE Audio Bluetooth audio technology, supporting Bluetooth 5.3, the industry’s first full-link wireless true Hi-Fi, as well as intelligent ultra-wide band noise reduction, non-sensitive body temperature monitoring, LC3 gaming low latency, multi-device dual connection, etc.
According to the previous preview, Vivo TWS 3 series headphones transmit a bit rates of up to 1.2Mbps, are equipped with a high-performance DAC chip, equipped with an ultra-wideband HD unit above 40kHz, will be released this month.
The blogger @ digital chat station revealed that Vivo TWS 3 will be the first in China Qualcomm S5 QCC5171 chip + 12.2mm moving coil + independent DAC chip + DSP module, adaptive EQ + ultra-wideband noise reduction than the previous generation to improve a lot, we can look forward to.
