In July, TSMC’s consolidated revenue was NT$186.763 billion (RMB42.022 billion), up 6.2% sequentially and a record high of 49.9% year-over-year. From January to July this year, revenue was approximately NT$1.21 trillion (approximately RMB 272.25 billion), up 41.1% year-over-year.
In the second quarter, TSMC’s consolidated revenue reached approximately NT$534.14 billion (approximately RMB 121.25 billion) and net profit after tax was approximately 237.03 billion (approximately RMB 53.806 billion).
According to Taiwan Economic Times, TSMC will hold a technology forum in Hsinchu on August 30, which will reveal the latest technology progress and customer results, and the outside world is highly concerned about whether TSMC will release more news about the 2nm process.
It is worth mentioning that TSMC debuted its 2nm process with a nanosheet crystal architecture at a technical forum in North America in June this year, and mass production is expected to begin in 2025.
From the data previously given by TSMC, the N2 is its first node to use an encircling gate transistor (GAAFET) instead of the current FinFET (finned field effect transistor).
The new manufacturing process will provide overall performance and power benefits. The N2 is 10-15% faster than the N3E at the same power consumption; 25-30% lower power consumption at the same speed. However, compared to the N3E, the N2 only increases chip density by about 10%.
TSMC has positioned the N2 process for various mobile SoCs, high-performance CPUs and GPUs, and the specific performance will not be known until subsequent tests are released.
