According to Korean media The Elec report, LG Innotek located in Gumi City, Gyeongsangbuk Province, South Korea FC-BGA factory recently held the first machine factory ceremony, the company’s president Zheng Zhe Dong and a number of senior executives attended.
LG Innotek said in a press release that the plant will begin mass production of flip chip ball grid array (FC-BGA) substrates, which will be used in Apple’s M-series processors in the future, in the second half of this year.
FC-BGA (Flip Chip-Ball Grid Array) substrates are high-density semiconductor packaging substrates that enable high-speed and multi-functionalization of LSI chips. Toppan has developed ultra-high-density wiring structure substrates using its original microfabrication technology and laminated wiring board technology to provide products that support the microfabrication needs of semiconductor processes.
The new FC-BGA plant is scheduled to be completed with a mass production system in the first half of the year, and full mass production will begin in the second half of the year. It will be built as an intelligent factory integrating the latest digital transformation technologies such as artificial intelligence, robotics, unmanned and intelligent.