JCET announced that the company’s XDFOI Chiplet high-density multi-dimensional heterogeneous integration series process has entered the stable mass production stage as planned, and simultaneously realized the shipment of 4nm node multi-chip system integrated packaging products for international customers, the largest A system-in-package with a package area of approximately 1500mm².
JCET launched XDFOI, a high-density multi-dimensional heterogeneous integration technology platform for Chiplets (small chips) in July 2021, using the concept of collaborative design to realize the integration and testing of finished chip products, covering 2D, 2.5D, and 3D Chiplet integration technology.
JCET XDFOI uses small chip heterogeneous integration technology to place one or more logic chips (CPU/GPU, etc.), as well as I/O Chiplet and/or Or high-bandwidth memory chips (HBM), etc., to form a highly integrated heterogeneous package. On the one hand, the high-density fcBGA substrate can be “slimmed down”, and part of the wiring layer can be transferred to the organic redistribution stacked interposer substrate, taking advantage of the advantages of the minimum line width and line spacing of the organic redistribution stacked interposer layer of 2 μm and multi-layer rewiring to reduce the size of the substrate. On the other hand, part of the interconnection on the SoC can also be transferred to the organic rewiring stacking interposer, so as to realize chiplet-based architectural innovation, and ultimately To achieve the dual advantages of performance and cost.
JCET’s XDFOI technology can control the thickness of the organic redistribution stacked interposer within 50 μm, and the center distance of micro-bumps (µBump) is 40 μm, achieving high-density packaging in a thinner and smaller unit area. Various processes are integrated to achieve higher integration, stronger module functions and smaller package size. At the same time, metal deposition can also be carried out on the back of the package, which can effectively improve the heat dissipation efficiency and at the same time enhance the electromagnetic shielding ability of the package according to the design requirements, and improve the yield rate of finished chips.
JCET XDFOI Chiplet high-density multi-dimensional heterogeneous integration series technology has been applied in high-performance computing, artificial intelligence, 5G, automotive electronics and other fields.
