With the explosion of generative AI, the demand for GPUs has also increased, so Nvidia has placed additional orders with TSMC to accelerate the production of GPUs.
It is reported that Nvidia has added CoWoS (wafer-level chip) packaging orders to TSMC, and will add another 10,000 pieces to meet demand based on the scheduled volume in 2023.
Note: The report did not mention which GPU models Nvidia plans to add specifically, indicating that TSMC will produce an additional 1,000-2,000 wafers per month for the remainder of this year. TSMC’s monthly CoWoS packaging capacity is between 8,000 and 9,000 wafers.
With the widespread adoption of the NVIDIA CUDA platform for AI and other high-performance workloads, dozens of major customers rely on the company’s hardware to run their AI applications. Just yesterday, Google announced its new A3 supercomputer with 26,000 NVIDIA H100 accelerators and 26 exaflops of AI capabilities.
