Bosch is planning to acquire US chipmaker TSI Semiconductors in order to further expand its semiconductor business.
TSI Semiconductors, headquartered in Roseville, California, USA, employs 250 people and is an application-specific integrated circuit (ASIC) foundry.
TSI currently develops and manufactures a large number of chips on 200mm silicon wafers for the mobile, telecommunications, energy and life sciences industries.
Bosch plans to inject US$1.5 billion into TSI after the acquisition to transform its semiconductor manufacturing facilities into the most advanced processes. Bosch says the first chips will be produced in 2026 from 200mm wafers based on the innovative material silicon carbide (SiC).
Bosch is systematically strengthening its semiconductor business and will significantly expand its global SiC chip portfolio by the end of 2030. Bosch and TSI Semiconductor have reached an agreement not to disclose any financial details of the transaction, which is subject to regulatory approval.
