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Apple asked Samsung to use inkjet printing to seal the iPhone 14 Pro Dynamic Island opening

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The biggest highlight of the iPhone 14 Pro model is the Dynamic Island solution. In addition to the software interaction design, its hardware is provided by Samsung. According to Korean media The Elec, under the strong request of Apple, Samsung was forced to use inkjet printing (Ink Jet Printing, IJP) to seal the OLED screen openings around Dynamic Island to prevent oxygen or moisture from entering to extend the panel. service life.

On the iPhone 13, iPhone 14 and iPhone 14 Plus models, Samsung only uses the OLED inkjet printing method in the lamination process; while in the iPhone 14 Pro and iPhone 14 Pro Max models, Apple asked Samsung to also use the OLED inkjet printing method for the touch layer (touch layer) to increase the durability of the screen.

Samsung said it originally planned to use only laser cutting and sealing, but Apple insisted on using inkjet printing to seal the edges of the Dynamic Island and create a “isolation area” that separates the Dynamic Island from the rest of the OLED screen while eliminating edge issues. The unavoidable height drop created by the cuts piercing the uninterrupted panels.

In other words, at Apple’s repeated requests, Samsung was forced to use inkjet printing to complete edge sealing on openings like Dynamic Island, which Samsung had never done before.

Apple also asked LG Display to make such a screen, but its craftsmanship could not meet Apple’s requirements, so the iPhone 14 Pro’s screen was completely provided by Samsung. However, it is reported that LG Display’s current level of craftsmanship has met Apple’s requirements, which means that Apple’s iPhone 15 Pro models may use LG’s screens.

Inkjet printing (Ink-jet printing, IJP) is to dissolve the OLED material in a solvent to form a solution and then sprays it out with a nozzle and an extremely small volume (picoliter level, 1×10-12 L), a small ink droplet is precisely printed onto the pixel electrode, and after drying, the film layer of the device is formed. This process theoretically achieves 100% material utilization and is not limited by size, and there is no pressure for various sizes.

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