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AMD explains why mobile APUs do not use chiplets architecture

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AMD Vice President David McAfee recently explained in an interview with Korean media why the company does not use chiplets in mobile APUs.

McAfee believes that the transition to chiplets design in the mobile field will inevitably have a negative impact on processor power consumption.

Chiplet, also known as chiplet or small chip, is a type of die (bare chip) that meets specific functions. Through die-to-die internal interconnection technology, multiple module chips and underlying basic chips are packaged together to form a system chip. , to achieve a new form of IP reuse.

Processor TDPs for ultrabooks and thin-and-light notebooks typically range between 15-30W. AMD currently relies entirely on monolithic die design, and that won’t change in the short term.

When asked about why AMD’s chiplet design has been successful in desktop processors but has not been extended to the mobile field, McAfee’s answer is as follows:

 When developing new products for desktop and mobile, we consider monolithic and chiplet architectures.

 However, there are bound to be huge challenges in energy efficiency when notebook computers transition to chiplet architecture. If mobile chips adopt the chiplet architecture, they must make compromises in terms of power consumption.

 All things considered, we are now seeing processors with monolithic architectures that are more energy efficient than chiplet architectures. If this changes in the future, we may consider using chiplets in the mobile space.

It should be added that McAfee’s answer is limited to AMD’s mobile processors (APUs). Some Dragon Range processors in AMD’s Ryzen 7000 series of mobile processors use chiplet architecture, which are essentially desktop Ryzen 7000 chips but in a mobile BGA package.

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