TSMC said in its annual report to shareholders, despite the overall slowdown in the semiconductor industry in 2022, the company’s 12-inch equivalent wafer shipments reached 15.3 million, up 7.7% year-on-year.
Advanced chip manufacturing technology (below 7nm) wafers account for 53% of the total portfolio, compared to 50% in 2021. Overall, TSMC shipped 30% of all non-memory semiconductor products worldwide, a 4 percentage point increase in share.
TSMC said it is moving into the 2nm process (N2) and plans to enter risk production in 2024, and officially enter volume production in 2025.
TSMC executives said in the earnings call that TSMC still has the industry’s most advanced semiconductor technology in terms of density and energy efficiency.
The N3E process will increase semiconductor performance by 15 percent in volume production, while the N2 process will increase performance by 30 percent. Note: N3E is an upgraded version of TSMC’s 3nm node, and the company plans to begin volume production of the technology in the second half of this year.
