TSMC announced the next-generation 3Dblox version 2.0 open standard at OIP 2023 (Open Innovation Platform Ecosystem Forum), according to a report by Taiwan-based Business Times. TSMC design and technology platform deputy general manager Lu Lizhong said, TSMC to alliance to assist industry integration, to help customers accelerate into the new generation of AI.
According to the report, among the two major AI chip makers, AMD’s MI300 series has begun to import 3Dblox packaging architecture, and NVIDIA’s next-generation GPU B100 is expected to be imported in the second half of next year.
IC design industry said the semiconductor to heterogeneous integration and small chip (core particle) architecture, TSMC to establish standards will make the chip design more simplified and will help enhance the competitiveness of the industry.
Practitioners pointed out that the chip development in the past on the track of Moore’s law, process breakthroughs in the 2D level of micro-miniaturization technology, but with the physical limits, semiconductor efficiency for breakthroughs, into the 3D stacking new development stage. Following the 2.5D packaging process CoWoS, which has been favoured by NVIDIA and is in short supply, TSMC is actively establishing an open standard for the next-generation packaging 3Dblox, which is expected to shorten the development process from architecture to flow for customers.
TSMC’s Chairman, Mr. Liu Deyin, recently highlighted the 3D Blox standard. TSMC launched the 3Dblox open standard last year to simplify and modularize 3D IC design solutions for the semiconductor industry.
TSMC’s Vice President, Dr. Chen-Hua Yu, revealed that TSMC has developed various 3D IC technologies in order to bring circuits closer to each other, and that “in the future, there’s even a possibility for two different chips to grow together”. He analyzed that the efficiency of the semiconductor industry has tripled in the past 15 years, and the trend will continue, which is also equivalent to the TSMC curve that proposes the global semiconductor industry to triple the chip efficiency in 15 years.
