According to the introduction, designers can choose from a variety of compute options from 32MHz to 80MHz with multiple configurations of math acceleration and integrated analog signal chain components, including MCU on-chip zero-drift operational amplifiers and 12-bit, 4MSPS precision analog-to-digital converters.

The Arm Cortex-M0+ improves CPU performance from the Cortex-M0 (2.33 CoreMark/MHz to 2.46 CoreMark/MHz) and also integrates a memory protection unit (MPU), single-cycle I/O interface and microtracking cache (MTB) with the following key features.

• Armv6-M architecture
• AHB-lite bus interface, von Neumann bus architecture with optional single-cycle I/O interface
• Thumb / Thumb-2 subset instruction support
• 2 segment pipeline
• Optional 8-area MPU with subareas and background areas
• Non-maskable interrupts + 1 to 32 physical interrupts
• Wake-up interrupt controller
• Hardware single-cycle (32×32) multiplication
• Multiple sleep modes with integrated wait-for-interrupt (WFI), wait-for-event (WFE) and sleep-on-exit functions, sleep and deep sleep signals
• Multiple retention modes depending on implementation
• JTAG and serial line debug ports with up to 4 breakpoints and 2 watchpoints
• Optional microtrace cache

The release of dozens of Texas Instruments MCUs, supported by intuitive software and design tools, enables the MSPM0 MCU product family to help designers spend more time innovating, reduce evaluation and programming time, and cut design time from months to days, said Texas Instruments.

MSPM0L and MSPM0G MCUs are available through TI.com.co.uk and authorized distributors. These MCUs are available in a variety of package sizes, including 16- to 32-pin package options and 8 kB to 128 kB flash memory options.

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Previously, removing contaminants from camera lenses required manual cleaning, which could lead to system downtime or require the use of a variety of mechanical devices that could fail. of vibration to quickly remove contaminants on its own for rapid debris removal, thereby improving system accuracy and reducing maintenance requirements. The chipset provides designers with a compact and cost-effective way to use ULC in a variety of applications and different camera sizes.

ULC can make the widespread use of self-cleaning cameras and sensors a reality,” said Avi Yashar, TI product marketing engineer. Existing cleaning methods are costly and impractical, requiring complex mechanics, expensive electronics and a lot of processing to detect contaminants and perform cleaning. As applications ranging from automotive and traffic cameras to smart cities and manufacturing continue to evolve, where the number of cameras proliferates, there is an urgent need for a simple and cost-effective way to implement self-cleaning cameras.”

The ULC1001 controller includes proprietary algorithms for automatic sensing, cleaning, temperature and fault detection without any image processing, making the ULC technology ultra-adaptable for a wide range of camera lens designs. The chipset’s small form factor makes it possible to improve machine vision and sensing in a variety of applications, i.e., anywhere a camera or sensor might get dirty.

The use of TI’s ULC chipset eliminates the need for complex mechanical devices in lens cleaning systems and eliminates the need for manual intervention. Using proprietary algorithms, the ULC1001 ultrasonic cleaning DSP integrates a pulse-width modulator, current and voltage detection amplifiers, and an analog-to-digital converter. ti’s chipset, used with the DRV2901 piezoelectric transducer driver as a companion amplifier, enables ULC in a compact package with printed circuit board dimensions of less than 25mm x 15mm, reducing the bill of materials while providing more functionality than discrete implementations.

The ULC1001 DSP is in volume production and available on TI.com and through authorized distributors in a 4.5mm x 4.5mm, 32-pin HotRod Quad Flat No-Lead (QFN) package. and other channels.

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The new facility is said to be more than 30 percent larger than RFAB1, providing more than 630,000 square feet of total cleanroom space between the two facilities. 24 kilometers of automated overhead conveyor systems will seamlessly transfer wafers between the two facilities once completed.

Once fully operational, the Richardson facility will produce more than 100 million analog chips per day that will be used in a variety of electronics applications from renewable energy to electric vehicles.

RFAB1 is the world’s first analog semiconductor manufacturing facility to achieve Leadership in Energy and Environmental Design (LEED) Gold certification, which is designed to meet high levels of structural efficiency and sustainability criteria in rating systems.

RFAB2 expands TI’s existing 12-inch fab lineup. At the same time, it is also one of six new 12-inch fabs added by TI to enhance internal manufacturing capabilities, which together will enhance TI’s broad and diverse analog and embedded processing semiconductor products production. ti acquired LFAB in Utah in 2021 and is currently preparing for initial production to begin in the coming months. ti also announced last year four new plants in Sherman, Texas plants in Sherman, Texas, for a total investment of $30 billion. Construction of the first and second plants is underway, and the first plant is expected to be operational in 2025.

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