The report points out that the main reason currently restricting enterprises from deploying higher-standard LPDDR is cost, which requires foundries to purchase and upgrade complete production equipment. The report takes the vivo X100 Pro as an example, saying that the machine was reported to be equipped with LPDDR5T in November last year, but it was not upgraded in the end and used LPDDR5X.

It was previously reported that the International Semiconductor Standards Organization (JEDEC) will determine the LPDDR6 memory specification in the second half of this year, and Samsung and Hynix, two of the world’s leading DRAM manufacturers, are stepping up production of these LPDDR6 modules.

The same source also notes that LPDDR7 may debut in Nvidia’s upcoming RTX 5000 series and AMD’s RDNA4 GPUs.

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Although he did not provide detailed specification information, the early running scores of 3DMark Wild Life Extreme showed that the graphics score of Snapdragon 8 Gen 4 is around 7200 points, which is 10% higher than the Apple M2 (Note: Equipped with M2 The chip’s Mac Mini 2023 scores around 6800~6925 points). Of course, this is probably due to TSMC’s 3nm.

According to foreign media evaluation data, the current 3DMark Wild Life Extreme Unlimited running score of Snapdragon Can this achievement be inherited?

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Qualcomm senior vice president Chris Patrick said custom CPU cores “doesn’t necessarily mean more expensive,” but allows Qualcomm to find a different balance between pricing, power consumption and performance. However, it is noted that he also admitted that the cost of Snapdragon 8 Gen 4 may increase because Qualcomm wants to pursue “amazing performance levels.”

If Snapdragon 8 Gen 4 is really more expensive than Snapdragon 8 Gen 3, it may lead to an increase in the price of flagship phones in 2025, such as the Samsung Galaxy S25 series, Xiaomi 15 series, and so on.

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The post Qualcomm says Snapdragon 8 Gen 4 will use self-developed Oryon CPU core appeared first on TechGoing.

One of the most concerning points is that Qualcomm is investigating Samsung’s SF2P process, but the next product (Snapdragon 8 Gen 4) is confirmed to be based on TSMC’s N3E process.

In addition, Qualcomm Snapdragon 8 Gen 3 also has a 3nm version in addition to the TSMC 4nm version. Its Cortex-X4 and Cortex-A720 will be built using 4nm / 3nm processes. The specific details are unknown. It may be for improved versions such as “SM8475” Prepare.

At present, TSMC N3E is close to mass production, and N3P is now in the IP development stage, so it is difficult to expect N3P to be launched in 2025, but this possibility is not ruled out.

To sum up, Qualcomm’s deployment of flagship AP processes is as follows: N4P (Snapdragon 8 Gen 3) → N3E (Gen 4) → N3P (Gen 5) → SF2P.

Foreign media estimate that the Exynos process during the same period is: SF4P (2024) → SF3P (2025) → SF2? (2026), so the Snapdragon SoC will lag behind Exynos in 2026.

In other respects, Samsung’s 4LPP+ process has been taped out, and combined with previous revelations, it is speculated to be Exynos 2400 (S5E9945).

Judging from these data alone, it is difficult to judge whether this chip is a large-scale update or an update small enough to be called “squeezing toothpaste”, but at present, it seems that it is most likely just a general “customized” improved product.

Judging from the construction period, the new platform will include Xclipse920, so it is unclear whether the customization refers to Xclipse920 or a successor product.

Not surprisingly, Samsung’s goal in 2024 is Exynos 2400, and the next two products seem to have a basic framework and are currently under development.

Samsung Semiconductor customers include Tesla, Intel, Google, Sony, etc.

Samsung’s Harman mid-range SoC project is underway.

Beyond that, there’s some information on Meta, Intel, and AMD. Judging from the data, Meta (formerly known as Facebook) seems to be developing its own AR/VR GPU solution.

Intel reiterated some old tunes about Panther Lake Xe3 LPG, but also verified some previous revelations. In Xe3 based products, HPG appears to be Celestial.

In addition, AMD seems to be considering a multi-Die chip solution for the next generation of Sony PlayStation / Microsoft Xbox game consoles.

There is also information about the NVIDIA T239 chip that was previously rumoured to be used in Nintendo’s new machine, but T239 can be said to be quite an old platform. While this doesn’t confirm that the next-gen Switch will use the platform, it at least confirms the existence of the T239.

▲ Intel Big Core’s RPC and CPC are the abbreviations of Raptor Cove and Cypress Cove.

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Foreign technology media Android Headlines read Guo Ming-Chi a few days ago on Qualcomm’s revelations, that Qualcomm has now finalized the Snapdragon 8 Gen 4 chip production agreement with TSMC and Samsung.

Kuo says that Qualcomm is now moving forward with its 3nm chips, and has already partnered with TSMC and Samsung Foundry to produce the 2024 flagship processor.

After Samsung produced several generations of Snapdragon flagship chips for Qualcomm, the Snapdragon 8 Gen 2 order released last year went to TSMC due to severe heat generation and poor yields.

TSMC produced the Snapdragon 8 Gen 2 and Snapdragon 8+ Gen 1 chips for Qualcomm last year, and will be responsible for the Snapdragon 8 Gen 3 chips this year.

Although TSMC is ready for the 3nm process, most of the production capacity has been given to Apple, and Qualcomm also for the sake of reducing manufacturing costs, Snapdragon 8 Gen 3 still insists on using the 4nm process.

From the media point of view, TSMC is responsible for the production of the Qualcomm Snapdragon 8 Gen 4 processor, and Samsung is responsible for the production of the Qualcomm Snapdragon 8 Gen 4 “for Galaxy” processor, according to the situation of Snapdragon 8 Gen 2, the subsequent will be the “leading edition According to the Snapdragon 8 Gen 2, the processor will be opened to other cell phone manufacturers in the form of “leading version”.

There are also differences between TSMC and Samsung’s 3nm processes, with TSMC still using the old FinFET transistor architecture, while Samsung has moved to the more advanced GAA architecture, so it’s impossible to tell the difference at this point.

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Kuo says that Qualcomm is now moving forward with its 3nm chips and has already partnered with TSMC and Samsung Foundry to produce the 2024 flagship processor.

After Samsung produced several generations of Snapdragon flagship chips for Qualcomm, the Snapdragon 8 Gen 2 order released last year went to TSMC due to severe heat generation and poor yields.

TSMC produced the Snapdragon 8 Gen 2 and Snapdragon 8+ Gen 1 chips for Qualcomm last year, and will be responsible for the Snapdragon 8 Gen 3 chips this year.

Although TSMC is ready for the 3nm process, most of the production capacity has been given to Apple, and Qualcomm also for the sake of reducing manufacturing costs, Snapdragon 8 Gen 3 still insists on using the 4nm process.

According to media point of view, TSMC is responsible for the production of Qualcomm Snapdragon 8 Gen 4 processor, and Samsung is responsible for the production of Qualcomm Snapdragon 8 Gen 4 “for Galaxy” processor, according to the situation of Snapdragon 8 Gen 2, the subsequent will be the “leading edition According to the Snapdragon 8 Gen 2, the processor will be opened to other phone manufacturers in the form of “leading version”.

There are also differences between TSMC and Samsung’s 3nm processes, with TSMC still using the old FinFET transistor architecture, while Samsung has moved to the more advanced GAA architecture, so it’s impossible to tell the difference at this point.

The post Qualcomm Snapdragon 8 Gen 4 revealed, standard version of TSMC production appeared first on TechGoing.

The report claims that Qualcomm is moving away from ARM’s CPU design in favour of its own custom Oryon core solution on the Snapdragon 8 Gen 4 processor, which can boost multi-core performance by up to 40% compared to the Snapdragon 8 Gen 3 processor.

The word is that Qualcomm Snapdragon 8 Gen 4 has two “Nuvia Phoenix” performance cores and six “Nuvia Phoenix M” efficiency cores. Nuvia is the name of the company acquired by Qualcomm to develop custom CPUs.

In a tweet, Revegnus said that the Qualcomm Snapdragon 8 Gen 3 scored 1800 points in single-core performance and 6500 points in multi-core performance in the Geekbench 5 benchmark test.

The Qualcomm Snapdragon 8 Gen 4 has a single-core performance of 2070 and a multi-core performance of 9100 in the GeekBench 5 benchmark test, while the Qualcomm Snapdragon 8 Gen 4 has a multi-core performance of 2070 and a multi-core performance of 9100 in the same test, and the M2 has a multi-core score of 8800 to 9000 in GeekBench 5.

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