On September 24 South Korea’s gamma0burst released an internal Qualcomm document. Although most of the key information has been coded, we can still see some intentions about Qualcomm’s future foundry cooperation.
One of the most concerning points is that Qualcomm is investigating Samsung’s SF2P process, but the next product (Snapdragon 8 Gen 4) is confirmed to be based on TSMC’s N3E process.
In addition, Qualcomm Snapdragon 8 Gen 3 also has a 3nm version in addition to the TSMC 4nm version. Its Cortex-X4 and Cortex-A720 will be built using 4nm / 3nm processes. The specific details are unknown. It may be for improved versions such as “SM8475” Prepare.
At present, TSMC N3E is close to mass production, and N3P is now in the IP development stage, so it is difficult to expect N3P to be launched in 2025, but this possibility is not ruled out.
To sum up, Qualcomm’s deployment of flagship AP processes is as follows: N4P (Snapdragon 8 Gen 3) → N3E (Gen 4) → N3P (Gen 5) → SF2P.
Foreign media estimate that the Exynos process during the same period is: SF4P (2024) → SF3P (2025) → SF2? (2026), so the Snapdragon SoC will lag behind Exynos in 2026.
In other respects, Samsung’s 4LPP+ process has been taped out, and combined with previous revelations, it is speculated to be Exynos 2400 (S5E9945).
Judging from these data alone, it is difficult to judge whether this chip is a large-scale update or an update small enough to be called “squeezing toothpaste”, but at present, it seems that it is most likely just a general “customized” improved product.
Judging from the construction period, the new platform will include Xclipse920, so it is unclear whether the customization refers to Xclipse920 or a successor product.
Not surprisingly, Samsung’s goal in 2024 is Exynos 2400, and the next two products seem to have a basic framework and are currently under development.
Samsung Semiconductor customers include Tesla, Intel, Google, Sony, etc.
Samsung’s Harman mid-range SoC project is underway.
Beyond that, there’s some information on Meta, Intel, and AMD. Judging from the data, Meta (formerly known as Facebook) seems to be developing its own AR/VR GPU solution.
Intel reiterated some old tunes about Panther Lake Xe3 LPG, but also verified some previous revelations. In Xe3 based products, HPG appears to be Celestial.
In addition, AMD seems to be considering a multi-Die chip solution for the next generation of Sony PlayStation / Microsoft Xbox game consoles.
There is also information about the NVIDIA T239 chip that was previously rumoured to be used in Nintendo’s new machine, but T239 can be said to be quite an old platform. While this doesn’t confirm that the next-gen Switch will use the platform, it at least confirms the existence of the T239.
▲ Intel Big Core’s RPC and CPC are the abbreviations of Raptor Cove and Cypress Cove.
