Source: Intel Newsroom

Pat Gelsinger said that the current PC inventory is already at a healthy level, and he is optimistic about the future growth of AI PCs equipped with AI processors or equipped with AI computing capabilities, and predicts that AI will become a key turning point in the PC industry.

Pat Gelsinger said that the server industry has been relatively flat in recent years, but with the accelerated development of AI, the AI industry has transitioned from the training stage to the deployment stage, and all walks of life will revolve around AI, promoting the development of the server industry.

It is learned from reports that Gelsinger is actively promoting the IDM 2.0 strategy. In addition to brand business, it also has advanced packaging capabilities to support the semiconductor foundry business. In the future, it will compete with companies such as TSMC and Samsung.

Gelsinger emphasized that the original goal of advancing five process nodes within four years will be achieved. According to Intel’s roadmap, Intel 7 and Intel 4 have been completed, Intel 3 will enter mass production in the second half of this year, and Intel 20A and 18A are expected to enter mass production in the first half and second half of next year respectively.

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He said that Intel can achieve its four-year goal of promoting fifth-generation process technology as scheduled.

It is said that the Intel 7 process technology is currently in mass production, the Intel 4 process has also been mass produced, and the Intel 3 process is ready to start mass production. The Intel 20A process will be mass produced in 2024 as scheduled, and the final Intel 18A process has been determined. Design rules.

As for whether Moore’s Law has come to an end, he clearly responded “no”. He pointed to the glass substrate developed by Intel and said that this can use optics directly on the substrate. It will be a product after Intel’s 18A process. There will be other “very many” products in the future. Cool” development. He said that these new technologies are just getting started, and Intel will continue to launch new products to drive the development of the industrial ecological chain.

He also mentioned that Intel is currently entering the era of small chips, and the development trend of 3D packaging is taking shape. More than 120 companies have participated in the UCIe alliance, and a test chiplet integrating TSMC’s N3E process has been launched.

Intel has currently launched a 125W 14th generation Core desktop processor. This series of processors is the last generation of desktop processors based on the Intel 7 (formerly 10nm Enhanced SuperFin) process; while the first generation Core Ultra processors of the Meteor Lake series are based on The new Intel 4 process (Note: Parameters are between TSMC N5 and N3) will be available on December 14th.

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▲ Source: Intel

Arcuri said that Intel’s independent operation of the foundry business is based on TSMC’s business strategy of “not competing with customers”, but the market’s response to Intel’s independent operation of the foundry business has been cold, and Intel’s stock price fell sharply today. 6%.

▲ Source: Intel

According to reports, Wei Zhejia, president of TSMC, previously publicly stated at a technical forum that the key to TSMC’s success lies in the trust of customers. “Customers succeed first, and TSMC can follow suit.” This is something that competitors cannot do. TSMC does not have its own products and will not compete with customers.

▲ Source: Intel

Arcuri said he has long believed that Intel should pursue an external foundry model. Considering Intel’s desire to develop the foundry business, increasing investment in advanced technology R&D, and restrictions on the US Department of Commerce’s semiconductor subsidy conditions, it is almost a foregone conclusion that Intel will abandon internal manufacturing and switch to the external foundry. Intel’s next step needs to be completely split The IFS department is responsible for wafer fabrication.

▲ Source: Intel

Arcuri pointed out that Intel should be split according to the model of the foundry business and fabless product business. Separating the financial statements of the two major businesses is the most important first step. Because Intel found in the survey that all potential major customers of the foundry business said that if they need to compete with Intel itself for foundry resources, they will not choose Intel’s foundry services. Arcuri predicts that Intel’s next step may be to completely spin off the foundry business to avoid concerns about competing with customers.

▲ Source: Globalfoundries

It is noticed that Intel CEO Pat Gelsinger hopes to replace Samsung in 2023 and become the world’s second-largest foundry business. In addition, Pat Gelsinger also said that appropriate firewalls will be set up to distinguish customer information and protect customer-sensitive design data.

▲ Source: Globalfoundries

According to reports, Intel’s biggest competitor, AMD, sold its manufacturing business Globalfoundries to the Mubadala Fund of the United Arab Emirates in 2008 and transformed it into a fabless semiconductor company. Globalfoundries is now the world’s third largest wafer foundry, second only to TSMC and Samsung, but if Samsung is excluded for its own chip foundry, GlobalFoundries ranks second.

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Intel has not yet made a clear investment plan in Japan, but it is reported that the company has contacted a number of local partners for in-depth cooperation in the fields of packaging technology and quantum computing.

Patrick Gelsinger said in an interview with Nikkei Asian Review that Japan plays a very important role in the semiconductor industry.

First of all, Japan’s semiconductor companies first consider how to reduce their impact on the environment; secondly, Japan is developing rapidly in supercomputers and quantum computers; finally, Japan has attracted many partners to create infrastructure for testing and manufacturing semiconductor components.

Patrick Gelsinger believes that Japan continues to maintain a leading position in semiconductor components. The interview is as follows: “All countries in the world are advancing and deploying advanced packaging technology. Japan has a leading edge in this area and is constantly consolidating its position in the global market. position”.

Patrick Gelsinger explained that talks are ongoing with a Japanese partner, but declined to give their specific details. The Intel boss said only that the company would expand its activities in Japan in the field of research on new ways to package chips.

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Pat Gelsinger is expected to appear at his annual Intel Vision technology conference on May 21, according to people familiar with the matter. In addition to explaining Intel’s latest blueprint, he will also discuss 3nm process cooperation with TSMC President Wei Zhejia and seek TSMC’s foundry capacity support. It was previously reported that Pat Gelsinger had visited TSMC twice in April and December 2022, but Pat Gelsinger’s second visit was at TSMC’s Arizona wafer plant in the United States when the “first batch of machine equipment arrived”. Factory” ceremony, so failed to meet with TSMC’s top decision-makers.

In recent years, Intel has faced crises such as the loss of market share, two consecutive quarters of losses, and delays in new manufacturing processes, which have led to a sharp drop in confidence in the supply chain. The reason why it is difficult to increase and the capacity utilization rate is not as expected.

According to Intel’s previous plan, cooperation with TSMC on the 3nm process will be officially launched on the Arrow Lake processor released in the second half of 2024.

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Intel previously said it plans to invest 80 billion euros in the European semiconductor sector over the next 10 years, and that the Italian project will be an advanced packaging and assembly plant.

In a statement to Reuters, Intel said: “We continue to have discussions with Italy,” adding that it remains “excited about the project.

The uncertainty is reportedly due in part to the pending approval of the European Chip Act, legislation that is expected to free up funds to boost Europe’s semiconductor industry, including subsidies for companies, including Intel, to build manufacturing facilities.

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Pat Gelsinger said that as “super technological forces” become increasingly ubiquitous, they are unlocking new and more powerful possibilities. Gelsinger also interpreted the five “super technological forces”:

Computing: Everything is equivalent to a computer. The invention of the 4004 chip essentially started a quantum leap in the modern computing world. Today, 50 years after the 4004 chip was created, nearly everything we interact with is “smart” and has the ability to compute. Today, computing defines the way people experience the world.

Connected: Everyone and everything is connected. Wi-Fi is a key technology in wirelessization, allowing people to move freely while using the network. 5G, 6G will further promote the establishment of safe and reliable connections between everyone and everything.

Infrastructure: Intel is creating a dynamic, reliable path for data storage and interconnected computing. Taking the delivery of visual experience as an example, such as streaming media services, cloud games, and other visual loads, by combining the infinite scale and capacity on the cloud with the infinite coverage of the intelligent edge, the demand for lower latency and higher bandwidth can be met at the same time. demand.

Artificial Intelligence: With intelligence everywhere, AI turns endless data into actionable insights. Data and computing, enabling AI algorithms to predict and create with greater precision. For example, software capable of writing intelligent software at scale.

Sensing and Perception: Collaboration is critical, both for humans and the technologies we create. A technological superpower, sensing and perception is bringing together education, research institutions and businesses to find ways to make human life better.

Furthermore, Pat Gelsinger stated that each of the five “supertechnological superpowers” builds on the others as technology becomes increasingly important to all aspects of human existence today, while also reinforcing each other, thus forming a powerful cycle that continuously increases influence and accelerates technological innovation, exploration and growth.

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Intel itself has had a factory in Arizona since 1980 and is building a new one. Pat Gelsinger said that he is very happy to welcome friends from TSMC. TSMC today held a celebration ceremony for the arrival of the first batch of machines and equipment in Arizona, USA, and demonstrated its support for American manufacturing; we firmly believe that a diverse and resilient layout under globalization can bring benefits to semiconductor manufacturing operations value.

Pat Gelsinger also mentioned that Arizona has excellent engineering talents and is an ideal location for semiconductor manufacturing; since Intel started semiconductor manufacturing there in 1980, it has been committed to the cultivation of local ecosystems and talents. With Intel, TSMC and others continuing to invest in the region, Arizona’s talent will play an important role in the future of the semiconductor industry.

Intel is working to boost its manufacturing capacity as it grapples with falling revenue and a sharp drop in demand for personal computers, which account for more than half of its sales. The company said in October that actions including layoffs and slowing spending on new factories would save $3 billion next year, with annual cuts growing to $10 billion by the end of 2025.

In addition to the first fab in Arizona, which is scheduled to begin production on N4 process technology in 2024, TSMC has also announced the start of construction on a second fab, scheduled to begin production on 3nm process technology in 2026. The combined investment in the two fabs is approximately $40 billion, the largest foreign direct investment in Arizona history and one of the largest in U.S. history.

TSMC held a celebration ceremony for the arrival of the first batch of machines and equipment in Arizona. U.S. President Joe Biden attended, and TSMC’s main customers Apple CEO Cook and Nvidia CEO Huang Renxun were present.

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