Now, MSI officially released the test data, saying that the running score has increased by 20%.

After the function is turned on, a Memory Timing Preset sub-option will appear at the bottom, and there are four levels in it, namely Tightest, Tighter, Balance and Relax, and the intensity decreases from top to bottom. For the corresponding relationship, it is recommended to choose the highest-grade Tightest for the DDR5 memory of Hynix ADie particles, the Tighter for Hynix MDie and Samsung chips, and the last two for Micron chips with little potential.

The memory sticks used here are Acer’s Lingshuang 6000C30 EXPO, Hynix ADie particles, directly select the Tightest file. Other settings remain unchanged (EXPO on, UCLK=MEMCLK).

AIDA64 running score: read 76715 MB/s, write 78386 MB/s, delay 72.9 ns without opening. After turning on the highest gear, memory reading increased to 86082 MB/s, an increase of 12.2%; writing reached 91333 MB/s, an increase of 16.5%; latency decreased to 63.7 ns, an increase of 12.6%.

Master Lu’s running score: The memory score is 230,211 points when it is not turned on, and it soars to 277,606 points after it is turned on, an increase of 20.6%.

The method of opening the new functions of MSI attached is as follows:

The post MSI motherboard memory optimization features tested: 20% score improvement appeared first on TechGoing.

According to reports, there is a High Efficiency mode under the overclocking interface of the BIOS, in which select the Memory Timing Preset option, which is divided into 4 levels, and you can choose the appropriate option according to your own particle characteristics.

Take MPGX670E CARBON WIFI Diablo as an example, use Hynix A DIE granular memory, FCLK 2100, UCLK synchronization, select the Tightest option in the settings. After it is turned on, the read and write speeds are increased by 16% and 20%, respectively, and the delay is also reduced from 61.7ns to 57.1, indicating that the memory performance has been effectively improved when the frequency is 6400MHz.

In addition to Hynix A DIE granules, Hynix’s M DIE granule memory has also been improved after measurement, with a 15.8% increase in reading and an increase of about 11.5% in writing.

The above functions are realized through BIOS updates, and players in need can experience it by updating the latest version of BIOS.

The method of opening the new functions of MSI attached is as follows:

The post MSI AM5 motherboard optimized for Hynix A DIE memory: faster speed, lower latency appeared first on TechGoing.

MSI said that the MSI technical team used the EXPO DDR5-6000 Kingston 2x16GB kit to conduct a complete test in the latest BIOS, and the boot speed was also reduced from 43 seconds to 22 seconds (from pressing the power button to the Windows 11 desktop). Older BIOS boot memory restoration is not stable. It is recommended that players first download the latest BIOS from the MSI official website, which is relatively stable.

It was reported earlier that MSI has launched a new version of BIOS for 14 motherboards, covering a variety of chipsets from A620 to X670E.

The post MSI optimizes X670 / B650 series motherboards to reduce boot time by 50% appeared first on TechGoing.

Now the new BIOS based on the 1.0.0.4 program has been launched, and the BETA version will be provided for the first release. After the actual test, it is used normally, and the official version of the program will be downloaded later. This version mainly optimizes some details and supports Ryzen 7600, 7700 and 7900 processing For those who want to try something new, you can experience it first.

In addition, MSI has 3 unique features to help users overclock their systems, namely Adaptive Dual Mode Overclocking, PBO Temperature Wall and TDP Profile Presets.

Earlier, MSI introduced a brand new feature in MSI BIOS called Adaptive Dual Mode Overclocking, which provides 3 levels of preset and advanced options for users to choose. Then combined with AMD’s default PBO “Precision Boost Overdrive” and MSI’s OC settings, it provides higher CPU performance in single-core and multi-core.

The next feature is called PBO Temperature Wall, and MSI has built in several PBO temperature profiles, namely 85°C, 75°C, and 65°C, which will allow the CPU to run at the highest temperature. Also with these profile settings, the CPU will also run at a lower voltage to stay within thermal limits and keep the CPU temperature down.

The last feature is TDP configuration presets. It is a very friendly feature for those who are not familiar with CPU overclocking. An MSI exclusive configuration TDP provides several preset configuration files with different TDP settings to choose from in BIOS. This gives users nothing to worry about and don’t want to manually modify the settings, it’s just a one-time configuration. Configure TDP feature will work on all MSI X670 and B650 chipset motherboards.

To download the new version of BIOS, you can go to MSI official website www.msicn.com.cn, search for motherboard model → technical support → driver & download → download in BIOS.

The post MSI X670 / B650 new BIOS is open for download, supports AMD Ryzen 7000 series new processors appeared first on TechGoing.

Today, MSI released a preview message for its X670 series motherboards, introducing the tool-free installation of M.2 drives.

As shown above, this MPG X670E CARBON WIFI Diablo motherboard features this new M.2 fastener. The image above shows the motherboard with its own M.2 Frost Armor heatsink. There is a metal moving part at the end of the heatsink that you can push with your hand to the right and lift up gently to release and pop up the M.2 Frost Armor without the need for a screwdriver.

The M.2 drive body is also a tool-less design that allows the drive to be inserted into the M.2 slot and the clasp at the end to snap into place with a half-turn, thus eliminating the need to screw in each time.

Officially, with the new design, the M.2 drive can theoretically be installed with one hand.

In addition, MSI also introduced the SSD heat sink for the X670 motherboard. MSI said, considering that M.2 will support PCI-E 5.0, the MSI X670 motherboard’s Frost Armor heatsink is also specially designed with a double-layer structure to bring a larger heat transfer area to enhance the cooling effect of M.2 drives, which can keep the PCI-E 5.0 drives operating at full speed for as long as possible with a maximum speed of 13GB per second.

AMD will hold a “together we advance_PCs” live event on August 30 at 7 a.m. Beijing time to unveil the next generation of AMD PC products.

The post MSI Preheats New X670 Motherboard: Tool-Free M.2 Drive Installation appeared first on TechGoing.

As of now, the MSI MPG X670E Carbon WiFi, a high-end product, starts at 562.19 euros (about 3890.35 yuan) and goes up to 640.15 euros, while the Pro X670-P WiFi motherboard starts at 374.35 euros (about 2590.5 yuan) and goes up to 416.50 euros.

In any case, even if Europe is a high-price area, this pricing is a relatively high range. Overall, the reference value is not too high, and we still have to wait for AMD’s official release.

MSI’s next-generation X670E CARBON WIFI motherboard also lists parameters such as support for PCIe Gen 5 storage and graphics cards, as well as.

Extended heatsink with heatpipe

18+2 phase / 90A power supply

Lightning Gen 5 slot and M.2 support

M.2 screwless design

On-board 2.5G LAN & WIFI 6E

USB Type-C support up to DP 2.0

The MSI PRO X670-P WIFI motherboard is relatively more user-friendly, combining stability, expandability and high quality and other good qualities, which will become a mainstream product if nothing else.

The X670E motherboard will be equipped with a 10-layer PCB design, while the X670 motherboard only has an 8-layer PCB. that is to say, the X670E class motherboard is not only PCIe5 dual-compatible that difference, but also may have higher stability and quality.

According to the official announcement of the features, the X670 motherboard may not provide both PCIe 5.0 for the sole display and M.2 support, so it will also be more cost-effective:

Extended heatsink design

14+2 phase / 80A SPS level power supply

Lightning Gen 5 M.2 support

1x dual-sided M.2 Shield Frozr

On-board 2.5G LAN & WIFI 6E

USB Type-C support up to DP 2.0

The post AMD’s new Rex 7000 driver, MSI AM5 motherboards hit the shelves early appeared first on TechGoing.