According to MSI news, after engineers continue to optimize motherboards and memory, MSI’s AM5 platform motherboards such as X670 and B650 have recently carried out a wave of mainstream Hynix A DIE particles and M DIE particles. optimization.
According to reports, there is a High Efficiency mode under the overclocking interface of the BIOS, in which select the Memory Timing Preset option, which is divided into 4 levels, and you can choose the appropriate option according to your own particle characteristics.
Take MPGX670E CARBON WIFI Diablo as an example, use Hynix A DIE granular memory, FCLK 2100, UCLK synchronization, select the Tightest option in the settings. After it is turned on, the read and write speeds are increased by 16% and 20%, respectively, and the delay is also reduced from 61.7ns to 57.1, indicating that the memory performance has been effectively improved when the frequency is 6400MHz.
In addition to Hynix A DIE granules, Hynix’s M DIE granule memory has also been improved after measurement, with a 15.8% increase in reading and an increase of about 11.5% in writing.
The above functions are realized through BIOS updates, and players in need can experience it by updating the latest version of BIOS.
The method of opening the new functions of MSI attached is as follows:
