According to reports, Intel 4 is Intel’s first process node produced using EUV technology, which has “achieved significant improvements” in terms of performance, energy efficiency and transistor density. EUV technology will drive technologies such as AI, advanced mobile networks, autonomous driving and new data Applications with the highest computing power requirements, such as central and cloud applications.

The specific progress of each process is as follows:

 Intel 7 and Intel 4 have achieved mass production, and Intel 3 is progressing as planned, targeting mass production by the end of 2023.

 The Intel 20A and Intel 18A, which feature RibbonFET all-around gate transistors and PowerVia back-side power supply technology, are also “progressing well” and are targeting 2024.

 The Intel Core Ultra processor, codenamed Meteor Lake, was released on December 14 this year and uses the Intel 4 process node.

 The Xeon processor Sierra Forest will be available in the first half of next year. It has a highly energy-efficient energy-efficiency core (E-core) and uses the Intel 3 process node.

 The Xeon processor Granite Rapids will also be launched in the first half of next year, following the launch of Sierra Forest, and has a high-performance performance core (P-Core).

It was previously reported that Intel introduced the Intel 4 process at the ON Technology Innovation Summit held in September.

Intel said that compared with Intel 7, Intel 4 achieves twice the area shrinkage, brings high-performance logic libraries, and introduces multiple innovations:

 EUV lithography technology that simplifies the process

 lntel 4 is optimized for high-performance computing applications and supports low-voltage (<0.65V) and high-voltage (>1.1V) operation. Compared to Intel 7, Intel 4's iso power performance is improved by more than 20%.

 High-density MIM (metal-insulator-metal) capacitors enable superior power delivery performance

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Intel says Intel 4 achieves twice the area shrink compared to Intel 7, delivers high-performance logic libraries, and introduces several innovations:

EUV lithography for process simplicity

lntel 4 is optimized for high-performance computing applications, supporting both low-voltage (<0.65V) and high-voltage (>1.1V) operation. The iso power performance of intel 4 is improved by more than 20% compared to intel 7.

High Density MIM (Metal-Insulator-Metal) Capacitors for Superior Power Performance

It was reported earlier that the Intel 4 process is now ramping up to volume production with the debut of the new Meteor Lake processor. the Intel 3 process will also be ready for manufacturing in the second half of 2023.

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According to material previously shared by Intel, the next generation of Meteor Lake will use Intel 4 process and external processes, and for the first time introduce a “Tile” design with integrated CPU, SOC, core graphics and IOE chips.

Intel has not confirmed whether Meteor Lake is available for desktop platforms. Rumors suggest that Intel’s next-generation desktop processors will be a Refresh version of the 13th generation Core Raptor Lake, with only the mobile side being upgraded to Meteor Lake.

Intel Lunar Lake is expected to be a 15W low-power mobile CPU with a redesigned architecture that focuses more on performance per watt for mobile devices.

On the process side, Intel announced that Intel 7 process is in mass production, Intel 4 production is ready, and Intel 4 capacity will increase in the second half of this year with the launch of Meteor Lake. Intel 3 process is progressing as planned, and Intel 20A and 18A process test chips are already flowing.

The post Intel Confirms 14 Generation Core Meteor Lake Launch in Second Half with Intel 4 Process appeared first on TechGoing.

At present, Intel’s 12th and 13th generation processors are still using the Intel 7 process (formerly 10nm Superfin), and next year’s Meteor Lake will use a new generation of Intel 4 process (formerly 7nm).

Intel 4 will be Intel’s first FinFET process based on EUV extreme ultraviolet light technology, which can increase performance per watt by 20%, while Meteor Lake is scheduled to be taped in the fourth quarter of this year and shipped in 2023.

Intel 4 was followed by Intel 3, the last generation of FinFET-based technology with an 18% increase in performance per watt, and production was previously planned for the second half of 2023.

Next is the Intel 20A process. At that time, Intel will also abandon FinFET technology and turn to the GAA route. 20A will adopt two breakthrough technologies-PowerVia and RibbonFET. The former is Intel’s original power supply technology, and the latter is based on GAA technology. The new breakthrough is expected to come out in 2024.

The technology in and after 2025 is still under development, named Intel 18A, will continue to improve the RibbonFET technology, and will use ASML’s next-generation high-NA EUV lithography machine, but the mass production time is uncertain.

Intel now announces that its first high-volume EUV lithography machine in Europe has been switched on at Fab 34 in Ireland and has successfully produced a 13.5nm wavelength light source.

Earlier this year, Fab 34 in Ireland introduced an EUV lithography machine, a key enabler of Intel4 technology.

Manufactured by ASML in the Netherlands, the system is arguably the most complex machine ever built by man, Intel said. Since the delivery of the new EUV lithography machine, the local team has been installing and debugging, and this week ushered in an important moment, Intel officially launched the EUV lithography machine, and the 25KW laser successfully excited 13.5 nm wavelength EUV light source.

This is an important milestone on the road to mass production of Intel4 technology, and it is also the first time that a large-capacity EUV lithography machine has been used in Europe.

According to reports, the EUV system consists of more than 100,000 parts, 3,000 cables, 40,000 bolts and more than a mile of hose. After it arrived in Leixlip, the local team has been trying to figure out how to produce the first light, but the process is very complicated because it relies on an intricate technology of many factors, whether it is the lithography machine itself or the overall facility. The qualification of the system and the connection to the utility required a team effort to achieve it, even before it took 18 months just to build the factory and prepare the facility.

In this process, more than 100 ASML employees worked with contractors, Intel engineers and technician teams to build and deploy, and it is expected that Intel 4 technology will be ready for mass production in the next period of time.

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