Samsung said the newly developed FCBGA is suitable for high-performance autonomous driving systems and is one of the highest-tech products in automotive electronics.

▲ Source: Samsung Electro-Mechanics

According to reports, the circuit line width and spacing in this newly developed substrate are reduced by 20%, and it also realizes more than 10,000 bumps in a limited space (see the figure below for what is a bump), so you can design a With higher density semiconductors, the performance and efficiency of chips based on this substrate will also be improved accordingly. In addition, it addresses reliability issues, including improved flexural strength, for multi-chip packages that mount multiple chips simultaneously on a single substrate.

FC-BGA package can provide better electrical characteristics, and greatly increase pin density, reduce interference, improve heat dissipation performance, and reduce package size, so as to meet the needs of high-end products and high-performance products. Chip bumps are one of the key components in the FC interconnection structure. They have three main functions: forming an electrical connection between the chip and the substrate, forming a structural connection between the chip and the substrate, and providing heat dissipation for the chip.

Samsung Electro-Mechanics said that the new product has obtained AEC-Q100 certification, the reliability test standard for automotive electronic components, and can be used in various fields from body and chassis to infotainment and autonomous driving.

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The CV3-AD685 system-on-chip (SoC) developed by Ambarella can act as the “brain” of self-driving cars, with 20 times the performance of its predecessor CV2, Samsung officials said. It reads and analyzes input data from cameras and radar, and automatically selects the appropriate driving mode.

This collaboration will help transform the next generation of self-driving car safety systems, taking artificial intelligence processing performance, power and reliability to new levels,” Samsung said in an official press release.

Samsung’s press release that the company plans to have non-mobile products account for more than 50 percent of its revenue from its foundry business or contract chip manufacturing business by 2027.

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According to the plan, both parties will cooperate in product development, ecological synergy, and project solutions based on their respective advantages accumulated in the fields of autonomous driving computing chips and automotive operating systems, to jointly build a basic software and hardware platform for vehicles that meets market demand, provide “local cores” + “local software” solutions, and jointly promote the establishment of local solutions. “We will jointly promote the establishment of local high-performance automotive electronics ecological alliance.

According to the introduction, chips and operating systems are the foundation of automotive intelligence and networking, and the establishment of a combined software and hardware development model is crucial to the local automotive industry and requires the combined efforts of the industry chain to achieve. ZTE is a leading global provider of integrated communication solutions, relying on its core strengths and experience accumulated in the ICT field to create intelligent driving operating system solutions with high real-time, high certainty and high security. Black Sesame Intelligence focuses on high-tech research and development in the field of high-performance autonomous driving computing chips and platforms, based on core chip products and a complete customer empowerment system to help the rapid industrialization of product solutions related to the autonomous driving industry chain.

According to the official website, Black Sesame Intelligent Technology Co., Ltd. was established in 2016 and has established a perfect customer empowerment system, including self-research vehicle-grade image processing ISP and vehicle-grade deep neural network gas pedal NPU, Huashan series of high-performance autonomous driving computing chip, Shanhai artificial intelligence development platform, Hanhai autonomous driving middleware, travel and parking integrated perception algorithm and BEST Data data closed-loop solution, BEST Drive autonomous driving solution, all-dimensionally empowering car manufacturers to safely and quickly realize product implementation.

▲ Huashan II A1000L Autonomous Driving Perception Chip

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