Samsung Electro-Mechanics announced that the company has developed an automotive semiconductor substrate (FCBGA, Flip Chip-Ball Grid Array) suitable for advanced driver assistance systems (ADAS), expanding the products of high-end automotive semiconductor substrates lineup, Samsung Electro-Mechanics plans to supply the product to customers around the world.
Samsung said the newly developed FCBGA is suitable for high-performance autonomous driving systems and is one of the highest-tech products in automotive electronics.
▲ Source: Samsung Electro-Mechanics
According to reports, the circuit line width and spacing in this newly developed substrate are reduced by 20%, and it also realizes more than 10,000 bumps in a limited space (see the figure below for what is a bump), so you can design a With higher density semiconductors, the performance and efficiency of chips based on this substrate will also be improved accordingly. In addition, it addresses reliability issues, including improved flexural strength, for multi-chip packages that mount multiple chips simultaneously on a single substrate.
FC-BGA package can provide better electrical characteristics, and greatly increase pin density, reduce interference, improve heat dissipation performance, and reduce package size, so as to meet the needs of high-end products and high-performance products. Chip bumps are one of the key components in the FC interconnection structure. They have three main functions: forming an electrical connection between the chip and the substrate, forming a structural connection between the chip and the substrate, and providing heat dissipation for the chip.
Samsung Electro-Mechanics said that the new product has obtained AEC-Q100 certification, the reliability test standard for automotive electronic components, and can be used in various fields from body and chassis to infotainment and autonomous driving.
