AMD CEO Zifeng Su said in an interview with Barron’s that Moore’s Law has not died out, but has only slowed down and that things need to be done differently to overcome performance, efficiency and cost challenges.
AMD has led the push for 3D packaging and Chiplet designs, introducing HBM designs in 2015; Chiplet designs in 2017; and the first 3D packaging solution for chips using 3D V-Cache designs in 2022.
The interview is as follows:
I can tell you with great certainty that I don't think Moore's Law is dead, it has just slowed down. We have to do different things to continue to get that performance and energy efficiency.
Software and algorithms are also very important. I think by fully mobilizing all the resources, it drives us to continue on the performance path.
The increase in transistor cost, the improvements that come with higher density and the overall performance improvement in each generation may be small, but we move forward step by step through continuous iterations.
We're doing a lot of work on 3nm today, and we're also working on 2nm. But we will continue to use Chiplet designs and these types of structures to try to get around some of the challenges of Moore's Law.
