Winbond Electronics, a major storage manufacturer in Taiwan, China, announced that it has joined the UCIe Industry Alliance. Combining its rich experience in 2.5D / 3D advanced packaging, Winbond will actively contribute to the promotion and popularization of high-performance Chiplet interface standards.
UCIe is an open chiplet interconnect protocol that will meet customer requirements for customizable packaging. The UCIe Industry Alliance was established in March 2022 by ten companies including AMD, Arm, ASE, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung and TSMC. The alliance was established to promote the standardization of Chiplet interface specifications, and has released the UCIe 1.0 specification. As of press release, the UCIe Alliance has more than 100 members.
As an open chiplet interconnection specification, UCIe defines the interconnection between chiplets in a package to achieve universal interconnection of chiplets at the package level and an open chiplet ecosystem.
After joining the UCIe alliance, Winbond can assist system-on-a-chip customers (SoC) design and 2.5D / 3D back-end process (BEOL, back-end-of-life) packaging connection.
According to Winbond Electronics, its 3D CUBE as a Service (3DCaaS, 3D CUBE as a Service) can provide customers with one-stop shopping services and provide customers with leading standardized product solutions.
In addition to consulting services, it also includes 3D TSV DRAM (aka CUBE) KGD memory chips and 2.5D/3D back-end processes optimized for multi-chip devices (using CoW/WoW technology), and can also be obtained by Winbond’s platform cooperation Technical consulting services provided by partners. This means that customers can easily get complete and comprehensive CUBE product support, and enjoy additional services for Silicon-Cap, interposer and other technologies.
“The UCIe specification will enable 2.5D/3D chip technology to realize its full potential in AI applications from the cloud to the edge,” said Fan Xiangyun, vice president of DRAM at Winbond. Affordability plays an important role.”
“We are delighted to welcome Winbond to the UCIe Alliance,” said Dr. Debendra Das Sharma, President of the UCIe Alliance, “As a global provider of high-performance memory solutions with 3D DRAM expertise, we look forward to their contribution to further develop the UCIe chiplet ecosystem. make a contribution.”
