CES 2023 will be held from January 5 to 8, but Samsung already has a number of innovative products on the CTA list, such as the Galaxy Z Flip4 and Galaxy Z Fold4 environmental innovations, Samsung S3B512C security chip, Samsung 16GB LPDDR5X + 1TB UFS 3.1 multi-chip packaging technology and so on.
Samsung’s 16GB LPDDR5X and 1TB UFS 3.1 multi-chip packaging technology is the first to integrate 14nm-based 16GB LPDDR5X DRAM and Samsung’s 7th Generation Quad Level Cell (QLC) V-NAND 1TB UFS (Universal Flash Storage) 3.1, demonstrating an industry-leading technological leap forward, according to the company.
Samsung’s award-winning UFS-based integrated multi-chip packages are currently used in a variety of high-end smartphones and electronics, as well as other industry-leading high-density, high-speed, low-power memory applications in flagship products, such as the LPDDR5x+ UFS 4.0 triangle that will soon be available in a host of Snapdragon 8 Gen2 phones.
The Samsung CTA Innovation Awards highlights also include AI home appliances, SmartThings Energy, Samsung 990 PRO SSD 2TB solid state drive, Automotive NVMe BGA SSD 1TB (AM991), 512GB CXL memory card, Samsung ISOCELL HP3 CMOS sensor, Samsung W920+RF 6550 next-generation wearable device enhancements and more.
