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Samsung failed to sign contract to manufacture new Snapdragon 7-series chips

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Qualcomm announced today that it will hold a new product launch conference for the Snapdragon mobile platform on March 17th, and it is expected to bring a new product of the Snapdragon 7 series chip – SM7475. However, according to SAMMOBILE, Samsung did not successfully sign the contract to manufacture the new Snapdragon 7 series chips this time.

It is reported that the new Snapdragon 7 series chips will use TSMC’s 4nm process because Samsung’s previous 4nm LPE process for Snapdragon 7 Gen1 chips is not as efficient as TSMC. From the perspective of energy saving, Qualcomm did not sign an OEM contract with Samsung for the new Snapdragon 7 series chips.

According to previous news, the new chip that Snapdragon will release this time is likely to be SM7475, which uses an octa-core CPU of 12.95Ghz+32.5Ghz+4*1.79Ghz, Adreno 730 GPU, and the AnTuTu comprehensive running score reaches 1029731 points, more than Dimensity 8200. The Geekbench 5 running score of the SM7475 chip has a single-core score of 1232 points and a multi-core score of 4095 points (This running score is higher than Dimensity 8200 and comparable to Dimensity 9000).

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