According to Korean media FNN, Google’s upcoming Tensor G4 chip will use the same “fan-out wafer-level packaging” (FOWLP) process as the Exynos 2400.
The report indicates that Google’s Tensor G4 chip will be mass-produced using Samsung’s 4nm process, but it is not yet certain which process will be used, but foreign media speculate that it is most likely a 4LPP+ node.
Note: FOWLP technology connects more I/Os so electrical signals can pass through the chipset faster and more efficiently. This packaging method also helps with heat tolerance, allowing its SoC to maintain higher levels of multi-core performance because its temperature can be controlled.
Samsung says on its Exynos 2400 product page that the technology improves multi-core performance by 8 percent.
A Google device codenamed “Google Tokay” has appeared in the Geekbench database, but it is not yet sure which phone “Tokay” is, it may be the Pixel 9, 9 Pro or Pixel Fold 2.
Data shows that this chip contains one ultra-large core clocked at 3.1 GHz, three large cores clocked at 2.6 GHz, and four medium cores clocked at 1.95 GHz. It is equipped with Arm Mali G715 GPU, and this engineering machine is only equipped with 8GB. RAM.
CPU
1xCortex-X4@3.1GHz
3xCortex-A720@2.6GHz
4xCortex-A520@1.95GHz
GPU
Mali-G715
