The ability to close to China Taiwan semiconductor industry chain of digital bloggers @ phone chip master today revealed that OPPO is currently developing a smartphone application processor, plans in the second quarter of 2023 tape out (design completion of the first attempt to stream), and will be mass produced in the third quarter, using TSMC 4nm process, external MediaTek 5G modem.
Then, another familiar digital blogger @digitalchat station gave a copy of his previous news, and the above information basically matches, suggesting that the matter has been finalized. He expects OPPO’s own chip to be released in 2024, with subsequent products likely to use a more advanced 3nm design solution.
It is worth mentioning that OPPO has previously launched its own Mariana X and Y chips, while the Mariana Y uses TSMC’s N6RF process and supports Bluetooth 5.3 and LE Audio.
Huawei previously announced a global patent cross-licensing agreement with OPPO Guangdong Mobile Communications Co. In other words, OPPO paid to obtain a license for Huawei’s advanced 5G technology.
In addition, according to the Dongguan release, the OPPO chip R&D center project site was successfully listed on December 27. The project site is located in Dongguan Jiaochengwan Peninsula, with a total investment of 4.5 billion yuan and covers an area of 387 mu, aiming to build a chip R&D center, chip experimental test center, semiconductor equipment research center, 5G terminal R&D center, artificial intelligence R&D center, etc.
According to the investment agreement, the construction period of this project is 36 months, with construction starting by January 2024 at the latest, completion and acceptance by January 2027, and operation by January 2028. After the future production, the annual investment in research and development will be more than 800 million yuan.
