MediaTek (MediaTek) released a new integrated automotive solution – Dimensity Auto Automotive Platform, further enriching the automotive portfolio.
Dimensity Auto covers a portfolio of solutions in four directions, including the Dimensity Auto cockpit platform, Dimensity Auto connectivity platform, Dimensity Auto driving platform, and Dimensity Auto key components.
The Dimensity Auto Cockpit Platform is based on advanced processes, high computing power and low power consumption, an integrated high-performance AI processor, deep learning gas pedal (MDLA) and vision processing unit (MVPU), flexible AI architecture and high scalability. The ISP image processor supports 16 camera accesses and generates HDR-quality video, and the platform provides high-fidelity audio through the HiFi5 DSP digital signal processor.
The Dimensity Auto connectivity platform solution offers high integration and interoperability, as well as high performance and low power consumption: 5G Sub-6GHz support provides highly reliable network connectivity, greater cellular network bandwidth and high speed through multi-carrier aggregation technology. Wi-Fi 7 supports MediaTek’s proprietary Hardware Offload Technology. Highly interoperable coexistence of multiple wireless network standards, including Wi-Fi and Bluetooth parallel anti-interference, Wi-Fi and 5G cellular network exclusive protocols, etc., allowing high-speed, stable and reliable network connections in and out of the car. Support multi-frequency GNSS global satellite navigation system, more accurate positioning.
The Dimensity Auto driving platform is equipped with the AI processor MediaTek APU, designed to provide a mature solution for smart driving.
Last but not least, Dimensity Auto key components provide diverse core technology and product portfolio for the automotive industry, including power management chips, screen driver chips, GNSS global satellite navigation system, camera ISP, etc., providing key component solutions for the automotive industry in the long term and Dimensity automotive-grade chipsets for the next generation of smart cars.
