The first photos of the Intel Core i9-13900K “Raptor Lake” retail packaging have surfaced on the web. It retains the basic design of the Core i9-12900K retail packaging, with the inner box shaped like a silicon wafer; however, the previous generation Alder Lake box had the silicon wafer placed at a visible angle with a large window for you to see it, the new i9-13900K box has the silicon wafer in the same direction as the front of the box, so that only the side of it is visible.
From this angle, it looks more like a microfilm reel. The color of the plastic wafer has also changed, instead of gold, it is replaced by silver.
The cardboard box’s cube shape is smaller in size and thinner in profile. We know that Intel’s top unlocked processor models do not offer cooling solutions, and this is no exception for the i9-13900K.
Intel is expected to launch the 13th generation Core “Raptor Lake” processor series on September 27th.
Intel’s 13th generation Core “Raptor Lake” desktop processors are expected to feature
- Up to 24 cores and 32 threads
- New Raptor Lake CPU cores (higher P-core IPC).
- Based on 10nm ESF “Intel 7” process node
- Up to 6.0GHz clock speed (expected)
- Doubling the number of E-Cores in some models
- Increased cache for P-Core and E-Cores
- Support for existing LGA 1700 motherboards
- New additions to the Z790, H770, and B760 motherboard lines
- 28 PCIe lanes (PCH 4th generation + 3rd generation)
- 28 PCIe lanes (CPU 5th Gen x16 + 4th Gen x12)
- Dual channel DDR5-5600 memory support
- 20 PCIe 5th generation lanes
- Enhanced overclocking capabilities
- 125W PL1 TDP (flagship SKU)
- AI PCIe M.2 technology
