After the current CEO of Intel Kissinger took office in February 2021, announced the largest transformation in Intel’s history, and launched the IDM 2.0 strategy, not only to retain their x86 chip manufacturing business but also to re-enter the foundry industry, with Samsung, TSMC to grab the market.
To this end Intel set up a new IFS foundry department, has served some customers, these two days Intel CEO Kissinger announced a new foundry model – the internal foundry model (internal foundry model), this model will not only be used for external foundry customers, Intel’s own products will also use this model. Intel’s own products will also use this approach to production.
Intel said that compared to the traditional foundry can only provide chip manufacturing or add a package model, Intel’s internal foundry model will open four major technologies, respectively, manufacturing, packaging, software and core (Note: core is the official name of the previously mentioned small chip design).
Intel’s official public number today also made a detailed explanation of the meaning of the four technologies are as follows:
First, wafer fabrication. Intel continues to aggressively advance Moore’s Law by offering customers its process technologies, such as RibbonFET transistors and PowerVia power supply technology, among other innovations.
Intel is steadily achieving its plan to advance five process nodes in four years.
Second, packaging. Intel will provide customers with advanced packaging technologies, such as EMIB and Foveros, to help chip design companies integrate different computing engines and process technologies.
Third, the core particles. These modular components provide greater flexibility in design, driving innovation across the industry in terms of price, performance and power consumption.
Intel’s packaging technology and the Universal Core Interconnect Open Specification (UCIe) will help cores from different vendors, or produced with different process technologies, to work better together.
Fourth, software. Intel’s open source software tools, including OpenVINO and oneAPI, accelerate product delivery and enable customers to test solutions prior to production.
In short, in the chip foundry industry, TSMC and Samsung are currently at the forefront, but Intel is ambitious and ambitious for this market, grabbing Samsung and TSMC’s share is destined, this time the internal foundry model is also their killer app to provide more additional services, with Intel’s new generation of 3nm, 20A and 18A processes in mass production in the next year or two. Intel’s threat to the other two will become greater and greater.
