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High-end chips can be produced without a lithography machine

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The performance of traditional mainly depends on the dense stacking of multi-layer transistors. Now with the emerging artificial intelligence, the components required to develop computer chips are getting higher and higher.

The research on atomic-level transistors led by Chinese scientist Zhu Jiadi of the Massachusetts Institute of Technology (MIT) made a breakthrough in April. The project uses a meteorological deposition layer-by-layer stacking process to produce a process of one nanometer or below without using a lithography machine. chip. This would reduce the size of the computer to only one-thousandth of the current size, and only one-thousandth of the current power consumption.


▲ Picture source MIT website

The new transistors are only about three atoms thick, so they can be stacked to make cheaper, more powerful chips. MIT researchers have thus developed a new technique to effectively and efficiently “grow” layers of metal disulfide (TMD) materials directly on fully fabricated silicon chips to enable denser integration of chip transistors. sex.

“Growing” transistor material directly onto silicon wafers is a major challenge because the chip manufacturing process typically requires temperatures of around 600 degrees Celsius, and silicon transistors and circuits can be damaged when heated above 400 degrees Celsius.

Now, an interdisciplinary team of MIT researchers has developed a low-temperature “growth” process that won’t damage the chip. The technique allows the direct integration of two-dimensional semiconductor transistors into standard silicon circuits.

The new technique can also significantly reduce the time required to grow these materials. While previous methods took more than a day to create a single layer of 2D material for chips, the new method can “grow” uniform metal dichalcogenides (TMDs) across an entire 8-inch wafer in less than an hour material layer.

This new technology is officially implemented, it can greatly reduce the cost of current chips, thereby reducing the price of the entire hardware market.

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