AMD’s upcoming Ryzen 7000 processor has been upgraded with the 5nm Zen4 architecture. The next work is all about marketing. The development team will turn to the future Zen5 and Zen6 architectures. AMD CEO Su Zifeng is also working on future products. Be prepared, and will discuss the 3nm and 2nm production capacity issues with TSMC soon.
According to reports, AMD CEO Su Zifeng and several senior executives will visit partners from the end of September to early November. They will mainly meet with chip manufacturing, packaging and PC manufacturers. One of the key targets is TSMC. Su Zifeng will meet with TSMC. Co-CEO Wei Zhejia discussed.
There is no specific information to announce the details of the cooperation, but Digitimes broke the news that the two parties are mainly discussing future process cooperation, including N3P and N2, which is TSMC’s 3nm and 2nm processes.
TSMC’s 2nm process will not be mass-produced until 2025, and it must be a manufacturer like Apple that will launch it first. It is estimated that AMD will be able to use 2nm until 2026 or even later, but the development cycle of large CPUs is usually more than 3 years. AMD is now discussing 2nm Craft is not early at all.
According to AMD’s roadmap, the Zen5 architecture after Zen4 is already in design and will be launched in 2024 with three architecture variants, Zen5, Zen5 V-Cache, and Zen5c, using a 4nm process initially and an upgraded 3nm process later.
In addition, AMD also mentioned that the Zen5 architecture will be built from the ground up to continue to scale performance and energy efficiency leadership for a wider range of workloads, meaning that this generation of architecture will push back and have higher IPC performance improvements compared to Zen4.
As for the 2nm process node, AMD should be Zen6 architecture by then, AMD’s official roadmap has not yet Zen6 shadow, should currently be in the design (Zen5 architecture should be finalized), and the launch time to 2026.