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New Apple AirPods patent can monitor the wearer’s brainwaves and other biosignals

According to the latest list published by the United...

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Xiaomi Civi 3 spotted on Geekbench, equipped with MediaTek Dimensity 8200-Ultra chip

On May 20th, Xiaomi officially announced that Xiaomi Civi 3 will be the world’s first Dimensity 8200-Ultra chip. It is said that this chip is a SoC tailored by MediaTek for Xiaomi Civi 3, which has been upgraded in terms of image and performance.

Xiaomi Civi 3 has appeared in the Geekbench database with the model number 23046PNC9C and the code name yuechu. The running score data shows that the machine is equipped with MediaTek Dimensity 8200 Ultra SoC, will also be equipped with 12GB RAM, and a pre-installed MIUI system based on Android 13.

In the Geekbench 6 running score, the single-core test score of the Xiaomi Civi 3 is 1148 points, and the multi-core test score is 3356 points, which is slightly better than the OnePlus 10R and Realme GT Neo 3 equipped with Dimensity 8100 Ultra.

According to previous revelations, Xiaomi Civi3 will support 5G inter-network roaming function, as long as the mobile phone has a 5G signal, it can access the 5G network of different operators without changing the SIM card. That is to say if you are using a telecom card and there is no telecom 5G but there is mobile 5G in your location, your phone will give priority to connecting to mobile 5G.

In addition, @Digital chat station said that this phone will adopt a front-facing dual-camera solution, both of which are 32-megapixel Samsung S5KGD2 sensors; the rear camera uses a Sony IMX800 outsole main camera (OIS); the screen supports a high refresh rate of 120Hz, Built-in 4500mAh, supports 67W fast charge.

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James Lopez
James Lopezhttps://www.techgoing.com
James Lopez joined Techgoing as Senior News Editor in 2022. He's been a tech blogger since before the word was invented, and will never log off.