As the end of the year approaches, the focus of attention is gradually shifting to the new generation of top flagships powered by Qualcomm’s flagship platform Snapdragon 8 Gen2, and the Xiaomi 13 series, which is once again rumored to debut the chip, is naturally the focus of attention. So far there have been a lot of revelations, including a lot of design details. The latest news is that a digital blogger has recently revealed that the device will have an extremely narrow chin.
The latest information released by well-known digital blogger @i Ice Universe shows that the bezel of the new Xiaomi 13 series flagship is a surprise, followed by a further “record-breaking chin”, and when asked by a netizen whether it was “a record-breaker for all phones or a record for Xiaomi”. This means that the chin will be an unprecedented width, which means that the screen-to-body ratio and visual effects will be stunning.
The new Xiaomi 13 series will, according to previous reports, generally follow the same design philosophy as its predecessor, the Xiaomi 12 series, with the front of the device still featuring a centered, straight screen, and the rear camera module on the back continuing the iconic lines of its predecessor, with three cameras and the distinctive “LEICA The rear camera module will continue the iconic lines of its predecessor, with three cameras and the distinctive “LEICA” lettering. In terms of hardware, the device is expected to debut with the new generation of Qualcomm Snapdragon 8 Gen2 flagship processor, based on TSMC’s 4nm process, with a new “1+2+2+3” octa-core architecture design, which should have no problem breaking 1.2 million points on the Rabbit. It also features a 50MP rear camera with OIS optical stabilization and 67W-120W super fast charging.
The new Xiaomi 13 series will reportedly debut in late November at the earliest and is expected to debut with the Qualcomm Snapdragon 8 Gen 2 flagship processor. We’ll see what more details we can come up with.
