Unlike wafer manufacturing, the semiconductor packaging process requires a large amount of human resource investment. This is because the front-end process only requires moving the wafer, but packaging requires moving multiple components, such as the substrate and the tray containing the product.
Prior to this, packaging and processing equipment basically required a lot of labor, but Samsung Electronics has achieved full automation through equipment such as wafer transfer equipment (OHT), elevators and conveyor belts that carry items up and down.
Kim Hee-yeol, general manager of Samsung Electronics TSP (Test and System Packaging), announced at the “2023 Next-Generation Semiconductor Packaging Equipment and Material Innovation Strategy Forum” that the company has successfully built the world’s first unmanned semiconductor packaging factory.
According to reports, this automated production line is located in the packaging factories of Samsung Electronics Cheonan City and Onyang City. It has been built since June 2023. This production line can reduce its manufacturing-related labor force by 85% and equipment failure rate by 90%. The efficiency is increased by more than 1 times.
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It is found that the proportion of unmanned production lines only accounts for about 20% of Samsung’s current packaging production lines, but Samsung has also set a goal of transforming its packaging factories into fully unmanned production by 2030.
Kim Hee-yeol said, “By minimizing shift work, engineers can now take on more valuable work,” “This will also help improve the health and quality of life of employees,” “We will realize the ‘smart packaging factory’, Based on hardware and software automation, we provide customers with high-quality, lowest-cost products in a timely manner.”