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Wingtech Technology: The 3rd-Gen compound semiconductor has been laid out, no gallium oxide related products

Wingtech Technology stated on the investor interaction platform today that the company has deployed the third generation of compound semiconductors, mainly focusing on technological opportunities brought about by reducing carbon emissions and green energy, and paying more attention to power devices. To enhance and expand the semiconductor product portfolio, provide more complex high-power products, including SiC and GaN. The company has no gallium oxide-related products, and will continue to pay attention to new semiconductor technologies.

In terms of packaging and testing technology, Wingtech Technology said that the company’s semiconductor business has a variety of advanced packaging and testing technologies such as LFPAK, clip bonding, and SiP (system-level packaging) and dozens of packaging and testing models, which can meet automotive customers, industrial and consumer customers. different product performance requirements.

In addition, Wingtech Technology stated that the company’s semiconductor business has deployed automotive-grade front-end wafers and back-end packaging and testing production capacity in China:

In terms of the front, considering the large total investment amount of the 12-inch wafer manufacturing project and the weak profitability in the early stage, in order to avoid the listed company from taking a large investment risk and the early stage of the project from adversely affecting the profitability of the listed company, the controlling shareholder will first Invest in the construction of 12-inch wafer manufacturing vehicle-level projects, promote the development and development of the semiconductor business of listed companies in China through foundry, and meet the actual needs of the company’s semiconductor production capacity;

In the back end, the company expanded its packaging and testing capacity in Dongguan for discrete devices, analog & logic ICs, power MOSFETs, etc., to enhance the scale advantage of semiconductor products. In terms of the camera business, the company is working hard to promote the development from a single customer to a diversified customer, expand the layout from the consumer field to the automotive field, and pull through vertical integration in product technology.

It is learned from the financial data of Wingtech Technology that in the first three quarters of 2022, Wingtech Technology achieved operating income of 42.085 billion RMB, a year-on-year increase of 8.90%; net profit attributable to shareholders of listed companies after deducting non-recurring gains and losses was 1.957 billion RMB, A year-on-year increase of 1.22%.

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Stephen Cruise
Stephen Cruisehttps://www.techgoing.com
Stephen Cruise is a senior editor covering latest smartphones, EVs, PC gaming, console, and tech with 11 years of experience.

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