Vivo officially announced today, a new generation of flagship phones Vivo X90 series and Hi-Fi wireless headphones Vivo TWS 3 series will be released on November 22 at 19:00, the new products have been on the reservation.
According to the previously revealed information, the new Vivo X90 series will include three versions of X90, X90 Pro, and X90 Pro + (reservation models are indeed these three), respectively, will be equipped with Dimensity 9200 and Snapdragon 8 Gen2 flagship platform. It is worth mentioning that the Vivo X90 series will have the world’s first Dimensity 9200 chip. The X90 series features a one-inch T* main camera from Zeiss and a new in-house developed chip V2. Other than that, the X90 series features a BOE eye protection screen, 120W extreme flash charging and the latest system OriginOS 3.
Vivo TWS 3 series headphones are equipped with a new generation of LE Audio Bluetooth audio technology, supporting Bluetooth 5.3, the industry’s first full-link wireless true Hi-Fi, as well as intelligent ultra-wideband noise cancellation, non-sensitive body temperature monitoring, LC3 game low latency, multi-device dual connection, etc. Headset transmission bit rate of up to 1.2Mbps, equipped with a high-performance DAC chip, will also be equipped with an ultra-wideband HD unit above 40kHz.