According to Taiwan’s Economic Daily News, TSMC, which has the advantage of advanced processes, is also actively laying out third-generation semiconductors to compete with manufacturers such as UMC, World Advanced and Force Semiconductor.
The foundry’s four strongest operating strategy is not only to reduce the impact of the boom cycle, but also to target the next wave of industrial growth momentum under the trend of 5G RF, artificial intelligence (AI), high-speed computing (HPC), and the growth of automotive electronics.
TSMC Chairman Liu Deyin has mentioned that the output value of third-generation semiconductors is on the small side, and the application side is mostly in the automotive field, which is a special technology, although at this stage it is still not comparable to silicon-based semiconductors, but TSMC’s third-generation semiconductor output should still be the largest.
TSMC’s first-generation GaN technology platform on silicon substrates was completed last year and further enhanced to support multiple applications.
In addition, UMC has invested in third-generation semiconductors through its investment in UMC. According to analysis, UMC and TSMC do not have the same strategy for the development of third-generation semiconductors, with TSMC focusing on GaN and power semiconductors, and UMC on power and microwave.
The World Advanced is working with equipment materials and silicon substrate manufacturers to develop new 8-inch substrate materials. World Advanced believes that although compound semiconductors account for only 1% of the overall market value of semiconductors, new materials such as gallium nitride and silicon carbide will provide promising business opportunities.
