According to DigiTimes, TSMC’s 2nm chip research and development work is on track, and the chips used in the iPhone 17 Pro and iPhone 17 Pro Max launched in 2025 will be the first to use this process.
Reports indicate that TSMC’s 2nm factory was also affected by the earthquake and some equipment needs to be replaced. However, since the current 2nm process is still in the research and development and trial production stages, the number of damaged wafers does not exceed 10,000.
The report points out that TSMC’s 2nm process has now finalized the mass production time. Trial production will begin in the second half of 2024, and small-scale production will gradually advance in the second quarter of 2025. Notably, TSMC’s new Arizona fab will also join the ranks of 2nm production.
TSMC plans to mass-produce the 2nm “N2” process at the end of 2025, launch the enhanced “N2P” node at the end of 2026, and then launch the first 1.4nm node in 2027, officially named “A14”.
According to media reports, the information about the chips used in Apple’s iPhone as follows:
iPhone XR and XS (2018): A12 Bionic (7nm, N7)
iPhone 11 lineup (2019): A13 Bionic (7nm, N7P)
iPhone 12 lineup (2020): A14 Bionic (5nm, N5)
iPhone 13 Pro (2021): A15 Bionic (5nm, N5P)
iPhone 14 Pro (2022): A16 Bionic (4nm, N4P)
iPhone 15 Pro (2023): A17 Pro (3nm, N3B)
iPhone 16 Pro (2024): “A18” (3nm, N3E)
“iPhone 17 Pro” (2025): “A19” (2nm, N2)
“iPhone 18 Pro” (2026): “A20” (2nm, N2P)
“iPhone 19 Pro” (2027): “A21” (1.4nm, A14)
