According to Taiwan’s “Economic Daily”, TSMC announced yesterday that in response to the strong market demand for advanced manufacturing processes, the Kaohsiung plant has determined production plans with 2nm advanced process technology.
TSMC confirmed at the press conference in April that the Kaohsiung plant had adjusted its 28nm production line to a more advanced process technology, but did not mention what process it would change to at the time. TSMC’s current 2nm production bases have planned Zhuke and Zhongke. If Kaohsiung is included in the future, the company will have three 2nm production bases.
In addition, according to Taiwan’s “Central News Agency”, TSMC’s planned 2nm process will be mass-produced in 2025, using a nanosheet transistor structure. At the same time, TSMC has developed a backside rail solution at 2nm, which is suitable for applications related to high-performance computing. It is targeted to be launched in the second half of 2025 and mass-produced in 2026.
▲ Picture source TSMC official website
According to previous reports, TSMC also announced that it will jointly invest in European Semiconductor in Dresden, Germany with Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors NV. Manufacturing Company (ESMC), with an estimated total investment of more than EUR 10 billion, to provide advanced semiconductor manufacturing services.
The fab is scheduled to be built in the second half of 2024 and produced by the end of 2027. It will be operated by TSMC, which will hold 70% of the shares, while Bosch, Infineon and NXP will each hold 10% of the shares. After completion, it is expected to produce 40,000 300mm (12-inch) wafers per month, using TSMC’s 28/22nm planar CMOS and 16/12nm FinFET process technologies.
