TSMC’s official website announced the launch of the university FinFET project, aimed at nurturing future semiconductor chip design talent and promoting global academic innovation. The program opens up the industry’s most successful process design kit (PDK) for finFET technology to university students, faculty and academic researchers to upgrade their chip design learning experience to the advanced 16nm FinFET technology. The program also provides leading chip researchers from universities and colleges with access to Multi-Project Wafer (MPW) services for 16nm (N16) and 7nm (N7) processes to accelerate impactful and innovative research into practical applications.
TSMC is working with service partners in Asia, Europe, and North America to provide universities and colleges with the following resources to support research projects for educational purposes and test chips.
TSMC’s N16 process-based design kits for educational use, including educational design cases, training materials, and educational videos to guide students from traditional planar transistor structures into the FinFET era.
For impactful research projects, including research designs for logic, analog, and RF applications, TSMC offers N16 and N7 process design-related kits to support test chips produced through MPW services.
As the industry’s most complete and vibrant design ecosystem, the Open Innovation Platform fully supports TSMC’s technology and manufacturing. TSMC’s Design Ecosystem Services partners are ready to connect with academics involved in university FinFET projects, see the program here.
