TSMC founder Chang Chung-Mou said in an interview that the current 5-nanometer fab set up in Arizona is the most advanced process in the United States, but TSMC’s most advanced process has gone to 3 nanometers. He himself confirmed that TSMC will set up the current most advanced 3nm fab in the United States.
TSMC’s 12-inch fab investment in Arizona will hold a shifting ceremony on December 6, TSMC said it plans to invite guests including customers, suppliers, academics and government representatives to celebrate the important milestone of the first machines and equipment to the plant, and Zhang Zhongmou and his wife will also attend in person. In addition, the U.S. Secretary of Commerce has agreed to attend the “first machine move” ceremony at TSMC’s Arizona fab. According to Chang, the U.S. Secretary of Commerce will fly from Washington to Arizona, and the flight time will take 6 hours each way, and the round trip will take 12 hours, which is a whole day’s trip.
TSMC pointed out that the arrival of machinery and equipment to the plant, it means that the plant has been partially completed and will be ready for the first batch of cutting-edge equipment for semiconductor manufacturing; construction of the Arizona 5nm plant started about 18 months ago, and the construction progress is as expected, and mass production will start in 2024 with a monthly capacity of 20,000 wafers.
Asked whether TSMC’s current state-of-the-art three-nanometer process might be transferred to other countries, such as the United States. Zhang Zhongmou said, “Yes,” Zhang Zhongmou said, there is a plan, but not completely finalized, I should say is almost finalized, is in same Arizona, “three nanometers is phase 2 (second stage), five nanometers is phase 1 (first stage). “
