TSMC is accelerating towards 2nm. According to MoneyDJ, the TSMC factory in Baoshan, Hsinchu is expected to start installing equipment in the second quarter of 2024, and mass production is expected to begin in the fourth quarter of 2025, with an initial monthly output of about 30,000 wafers.
TSMC’s Kaohsiung factory is also currently actively “preparing for war” and is expected to use backside power supply technology to mass-produce the N2P (2nm enhanced version) process one year after the launch of the N2 process.
It was previously reported that TSMC had previously revealed information that by expanding the backside power rail solution on the N2 process to reduce infrared attenuation and improve signals, performance can be improved by 10% to 12% and the logic area can be reduced by 10%. to 15%.
TSMC plans to deliver backside power rail samples to customers in the second half of 2025 and mass production in 2026.
Samsung’s previously announced semiconductor plan calls for mass production of 2nm in 2025 and 1.4nm in 2027; while Intel is expected to mass produce 20A using Gate All Around (GAA) technology RibbonFET transistor architecture in the first half of 2024. 18A will be mass-produced in 2025.
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