According to China Taiwan “Economic Daily” reported, Samsung strong attack on the advanced process of foundry, following the end of June announced 3nm industry-leading mass production, 4nm yield significantly improved, is proceeding to expand production, is expected to add 20,000 pieces of production capacity per month in Q4 this year, and planning on 4nm on the huge throw about 50,000 billion won (about 25.8 billion yuan) investment, and TSMC a high level. The company wants to grab more wafer foundry orders from TSMC for Qualcomm, AMD, Nvidia and other major manufacturers.
For related news, Samsung said it could not confirm the issue of increased production and investment. TSMC yesterday also did not respond to the relevant competitor information.
The industry pointed out that Samsung foundry capacity used to provide about 60% of its own chip production, the rest to undertake outsourcing orders, this year’s active expansion, and expansion to undertake foundry orders, the proportion of in-house chip capacity down to fifty percent. Research institutions estimate that Samsung in the scale of advanced process capacity is still only about TSMC one-fifth.
The first batch of chips foundry by Samsung Electronics using the 3nm process was officially shipped on July 25. Their process, the first in the industry to use the full surround gate transistor architecture, mass production and shipping time, are earlier than their rivals TSMC.
In April of this year, there was news that Samsung’s 4nm node capacity ramp-up had experienced some delays, but had entered the expected yield curve; its 5nm yields were entering maturity, meaning that yields had entered Samsung’s expected levels. There are rumors that Samsung Electronics Foundry’s 4nm process yields are being delayed, causing major customers such as Nvidia to entrust the foundry’s next generation products to TSMC for foundry work
